[1]
|
王超, 张蕊, 杜欣, 等. 新型热电材料综述[J]. 电子科技大学学报, 2017, 46(1): 133-150.
|
[2]
|
范天佑. 断裂理论基础[M]. 北京: 科学出版社, 2003.
|
[3]
|
Wu, H.J., Chen, B.Y. and Cheng, H.Y. (2017) The p-n, Conduction Type Transition in Ge-Incorporated Bi 2 Te 3, Thermoelectric Materials. Acta Materialia, 122, 120-129. https://doi.org/10.1016/j.actamat.2016.09.043
|
[4]
|
徐桂英, 葛昌纯. 热电材料的研究和发展方向[J]. 材料导报, 2000, 14(11): 38-41.
|
[5]
|
马秋花, 赵昆渝, 李智东, 等. 热电材料综述[J]. 电工材料, 2004(1): 43-47.
|
[6]
|
缪婷婷, 马维刚, 李震, 等. 一种测量热电材料塞贝克系数的新方法[J]. 工程热物理学报, 2011, 32(4): 629-633.
|
[7]
|
Jaumot, F.E. (1958) Thermoelectric Effects. Proceedings of the IRE, 46, 538-554.
https://doi.org/10.1109/JRPROC.1958.286827
|
[8]
|
任尚芬, 程伟. 能源效率、热电效应和纳米技术[J]. 物理, 2007, 36(9): 673-675.
|
[9]
|
Hicks, L.D., Harman, T.C. and Dresselhaus, M.S. (1993) Use of Quantum-Well Superlattices to Obtain a High Figure of Merit from Nonconventional Thermoelectric Materials. Applied Physics Letters, 63, 3230-3232.
https://doi.org/10.1063/1.110207
|
[10]
|
Jin, Z.H. and Wallace, T.T. (2014) Functionally Graded Thermoelectric Materials with Arbitrary Property Gradations: A One-Dimensional Semianalytical Study. Journal of Electronic Materials, 44, 1-6.
|
[11]
|
Fengrong, Y.U., Chen, S., Liu, W., et al. (2012) Current Studies and Perspective of Bi_2Te_3 Thermoelectric Materials. Journal of Yanshan University, 32, 525-540.
|
[12]
|
Li, S., Li, X., Ren, Z.F., et al. (2018) Recent Progress on High Performance of Tin Chalcogenides Thermoelectric Materials. Journal of Materials Chemistry A, 6, 2432-2448. https://doi.org/10.1039/C7TA09941J
|
[13]
|
Zhang, A.B., Wang, B.L., Wang, J., et al. (2017) Effect of Cracking on the Thermoelectric Conversion Efficiency of Thermoelectric Materials. Journal of Applied Physics, 121, Article ID: 045105. https://doi.org/10.1063/1.4974848
|
[14]
|
Today, P. (2007) New High-Efficiency Thermoelectric Material Achieved by Cracking the Crystal. Journal of AIP, 336-338, 842-845.
|
[15]
|
Wang, Y.Z. (2015) Effective Material Properties of Thermoelectric Composites with Elliptical Fibers. Applied Physics A, 119, 1081-1085. https://doi.org/10.1007/s00339-015-9072-9
|
[16]
|
宿太超. 高性能热电材料的高温高压合成研究[D]: [博士学位论文]. 长春: 吉林大学, 2009.
|
[17]
|
程靳, 赵树山. 断裂力学[M]. 北京: 科学出版社, 2006.
|
[18]
|
康颖安. 断裂力学的发展与研究现状[J]. 湖南工程学院学报: 自然科学版, 2014, 16(24): 39-42.
|
[19]
|
Song, H.P. and Li, C.F.G.J. (2015) Two-Dimensional Problem of a Crack in Thermoelectric Materials. Journal of Thermal Stresses, 38, 325-337. https://doi.org/10.1080/01495739.2015.1015369
|
[20]
|
Zhang, A.B. and Wang, B.L. (2013) Crack Tip Field in Thermoelectric Media. Theoretical & Applied Fracture Mechanics, 66, 33-36. https://doi.org/10.1016/j.tafmec.2013.11.006
|
[21]
|
Zhang, A.B. and Wang, B.L. (2016) Explicit Solutions of an Elliptic Hole or a Crack Problem in Thermoelectric Materials. Engineering Fracture Mechanics, 151, 11-21. https://doi.org/10.1016/j.engfracmech.2015.11.013
|
[22]
|
Zhang, A.B., Wang, B.L., Wang, J., et al. (2017) Thermodynamics Analysis of Thermoelectric Materials: Influence of Cracking on Efficiency of Thermoelectric Conversion. Applied Thermal Engineering, 127, 1442-1450.
https://doi.org/10.1016/j.applthermaleng.2017.08.154
|
[23]
|
Zeleke, M.A., Xin, L. and Liu, L.S. (2017) Bond Based Peridynamic Formulation for Thermoelectric Materials. Materials Science Forum, 51-59. https://doi.org/10.4028/www.scientific.net/MSF.883.51
|
[24]
|
Wang, P. and Wang, B.L. (2017) Thermoelectric Fields and Associated Thermal Stresses for an Inclined Elliptic Hole in Thermoelectric Materials. International Journal of Engineering Science, 119, 93-108.
https://doi.org/10.1016/j.ijengsci.2017.06.018
|
[25]
|
Lee, E.P., Hsia, S.H., Lin, J.J., et al. (2017) Hemodynamic Analysis of Pediatric Septic Shock and Cardiogenic Shock Using Transpulmonary Thermodilution. Biomed Research International, 2017, Article ID: 3613475.
https://doi.org/10.1155/2017/3613475
|
[26]
|
Jin, Z.H. (2015) Thermal Stresses in a Multilayered Thin Film Thermoelectric Structure. Microelectronics Reliability, 54, 1363-1368.
|
[27]
|
Jin, Z.H., Wallace, T.T., Lad, R.J., et al. (2014) Energy Conversion Efficiency of an Exponentially Graded Thermoelectric Material. Journal of Electronic Materials, 43, 308-313. https://doi.org/10.1007/s11664-013-2868-5
|
[28]
|
Liu, Y., Wang, B.L. and Zhang, C. (2016) Thermoelastic Behavior of a Thermoelectric Thin-Film Attached to an Infinite Elastic Substrate. Philosophical Magazine, 97, 43-57.
|
[29]
|
郭亚博. 热电材料热冲击阻力性能的研究[D]: [硕士学位论文]. 哈尔滨: 哈尔滨工业大学, 2015.
|
[30]
|
Wang, B.L., Guo, Y.B. and Zhang, C.W. (2016) Cracking and Thermal Shock Resistance of a Bi2Te3, Based Thermoelectric Material. Engineering Fracture Mechanics, 152, 1-9. https://doi.org/10.1016/j.engfracmech.2015.12.005
|
[31]
|
Huang, M.J., Chou, P.K. and Lin, M.C. (2006) Thermal and Thermal Stress Analysis of a Thin-Film Thermoelectric Cooler under the Influence of the Thomson Effect. Sensors and Actuators A: Physical, 126, 122-128.
https://doi.org/10.1016/j.sna.2005.10.006
|
[32]
|
Hikage, Y., Masutani, S., Sato, T., et al. (2007) Thermal Expansion Properties of Thermoelectric Generating Device Component. 26th International Conference on Thermoelectrics Proceedings, Jeju, 3-6 June 2007, 331-335.
https://doi.org/10.1109/ICT.2007.4569489
|
[33]
|
Ravi, V., Firdosy, S., Caillat, T., et al. (2009) Thermal Expansion Studies of Selected High-Temperature Thermoelectric Materials. Journal of Electron Materials, 38, 1433-1442. https://doi.org/10.1007/s11664-009-0734-2
|
[34]
|
Chuan-Bin, Y.U. and Gao, C.F. (2016) Analysis of a Circular Arc-Crack in Thermoelectric Media. 207-212.
|
[35]
|
Song, H.P. and Song, K. (2016) Electric and Heat Conductions across a Crack in a Thermoelectric Material. Journal of Theoretical & Applied Mechanics, 46, 83-98. https://doi.org/10.1515/jtam-2016-0006
|
[36]
|
Zhang, A.B. and Wang, B.L. (2013) Applicability of the Crack Faces Thermoelectric Boundary Conditions for Thermopiezoelectric Materials. Mechanics Research Communications, 52, 19-24.
https://doi.org/10.1016/j.mechrescom.2013.06.004
|
[37]
|
Zang, A.B. and Wang, B.L. (2016) Temperature and Electric Potential Fields of an Interface Crack in a Layered Thermoelectric or Metal/Thermoelectric Material. International Journal of Thermal Sciences, 104, 396-403.
https://doi.org/10.1016/j.ijthermalsci.2016.01.023
|
[38]
|
Ding, S.H., Zhou, Y.T. and Li, X. (2014) Interface Crack Problem in Layered Orthotropic Materials under Thermo-Mechanical Loading. International Journal of Solids & Structures, 51, 4221-4229.
https://doi.org/10.1016/j.ijsolstr.2014.08.007
|
[39]
|
Ding, S.H. and Li, X. (2015) Thermoelastic Analysis of Nonhomogeneous Structural Materials with an Interface Crack under Uniform Heat Flow. Elsevier Science Inc., New York.
|
[40]
|
Perez-Aparicio, J.L., Taylor, R.L. and Gavela, D. (2007) Finite Element Analysis of Nonlinear Fully Coupled Thermoelectric Materials. Computational Mechanics, 40, 35-45. https://doi.org/10.1007/s00466-006-0080-7
|
[41]
|
Clin, T., Turenne, S., Vasilevskiy, D., et al. (2009) Numerical Simulation of the Thermomechanical Behavior of Extruded Bismuth Telluride Alloy Module. Journal of Electronic Materials, 38, 994-1001.
https://doi.org/10.1007/s11664-009-0756-9
|
[42]
|
Turenne, S., Clin, T.H., Vasilevskiy, D., et al. (2010) Finite Element Thermomechanicial Modeling of Large Area Thermoelectric Generators Based on Bismuth Telluride Alloys. Journal of Electronic Materials, 39, 1926-1933.
https://doi.org/10.1007/s11664-009-1049-z
|
[43]
|
Picard, M., Turenne, S. and Masut, R.A. (2013) Numerical Simulation of Performance and Thermomechanical Behavior of Thermoelectric Modules with Segmented Bismuth-Telluride-Based Legs. Journal of Electronic Materials, 42, 2343-2349.
https://doi.org/10.1007/s11664-012-2435-5
|
[44]
|
杨利娜. 单边裂纹电磁热止裂强化对比研究及裂纹扩展实验方法[D]: [硕士学位论文]. 秦皇岛: 燕山大学, 2013.
|
[45]
|
Chen, L.S. and Lee, J.Y. (2015) Effect of Pulsed Heat Power on the Thermal and Electrical Performances of a Thermoelectric Generator. Applied Energy, 150, 138-149. https://doi.org/10.1016/j.apenergy.2015.04.009
|
[46]
|
Wang, B.L. (2017) A Finite Element Computational Scheme for Transient and Nonlinear Coupling Thermoelectric Fields and the Associated Thermal Stresses in Thermoelectric Materials. Applied Thermal Engineering, 110, 136-143.
https://doi.org/10.1016/j.applthermaleng.2016.08.115
|
[47]
|
Li, J.F., Pan, Y., Wu, C.F., et al. (2017) Processing of Advanced Thermoelectric Materials. Scientia Sinica Technologica, No. 9, 1-18.
|
[48]
|
Suhir, E. (2013) Could Electronics Reliability Be Predicted, Quantified and Assured. Microelectronics Reliability, 53, 925-936. https://doi.org/10.1016/j.microrel.2013.03.011
|
[49]
|
Ni, J.E. and Case, E.D. (2013) Thermal Fatigue of Cast and Hot-Pressed Lead-Antimony-Silver-Tellurium (LAST) Thermoelectric Materials. Journal of Electronic Materials, 42, 1382-1388. https://doi.org/10.1007/s11664-012-2254-8
|
[50]
|
Fukada, Y. (2010) Thermoelectric Element and Thermoelectric Module. US 20100059096 A1.
|
[51]
|
Pierce, J. and Vaudo, R.P. (2010) Methods of Depositing Epitaxial Thermoelectric Films Having Reduced Crack and/or Surface Defect Densities and Related Devices. WO, US 7804019 B2.
|
[52]
|
Jayaram, V., Shivakumara, C., Satyanarayana, M., et al. (2012) Study of the Stability of Na0.7CoO2 Thermoelectric Materials under Shock Dynamic Loading in a Shock Tube.
|
[53]
|
Wang, P., Barcohen, A., Yang, B., et al. (2006) Analytical Modeling of Silicon Thermoelectric Microcooler. Journal of Applied Physics, 100, Article ID: 014501. https://doi.org/10.1063/1.2211328
|
[54]
|
乐群. 高压烧结热电材料残余应力分析与数值模拟[D]: [硕士学位论文]. 武汉: 武汉理工大学, 2008.
|
[55]
|
戚德奎, 鄢永高, 李涵, 等. 快速急冷法对β-Zn4+xSb3材料热电及力学性能的影响[J]. 无机材料学报, 2010, 25(6): 603-609.
|
[56]
|
Case, E.D. (2006) Weibull Analysis of the Biaxial Fracture Strength of a Cast p-Type LAST-T Thermoelectric Material. Philosophical Magazine Letters, 86, 673-682. https://doi.org/10.1080/09500830600962720
|
[57]
|
Yoneda, S., Ohno, Y., Isoda, Y., et al. (2009) Mechanical Properties of PbTe Thermoelectric Materials by Three-Point Bending Fracture Strength Test. Journal of the Society of Materials Science Japan, 46, 174-177.
|
[58]
|
Gao, P., Berkun, I., Schmidt, R.D., et al. (2014) Transport and Mechanical Properties of High-ZT, Mg2.08Si0.4−x, Sn0.6Sbx, Thermoelectric Materials. Journal of Electronic Materials, 43, 1790-1803.
https://doi.org/10.1007/s11664-013-2865-8
|
[59]
|
Ni, J.E., Case, E.D., Schmidt, R.D., et al. (2013) The Thermal Expansion Coefficient as a Key Design Parameter for Thermoelectric Materials and Its Relationship to Processing-Dependent Bloating. Journal of Materials Science, 48, 6233-6244. https://doi.org/10.1007/s10853-013-7421-7
|
[60]
|
Schmidt, R.D., Case, E.D., Iii, J.G., et al. (2012) Room-Temperature Mechanical Properties and Slow Crack Growth Behavior of Mg2Si Thermoelectric Materials. Journal of Electronic Materials, 41, 1210-1216.
https://doi.org/10.1007/s11664-011-1879-3
|
[61]
|
刘刚. Bi2Te3或CoSb3宽温域热电材料的制备界面结构和力学性能[D]: [硕士学位论文]. 武汉: 武汉理工大学, 2012: 1-15.
|
[62]
|
Eilertsen, J., Subramanian, M.A. and Kruzic, J.J. (2013) Fracture Toughness of Co4Sb12 and In0.1Co4Sb12 Thermoelectric Skutterudites Evaluated by Three Methods. Journal of Alloys and Compounds, 552, 492-498.
https://doi.org/10.1016/j.jallcom.2012.11.066
|
[63]
|
Ma, J.M., Firdosy, S.A., Kaner, R.B., et al. (2014) Hardness and Fracture Toughness of Thermoelectric La3−xTe4. Journal of Materials Science, 49, 1150-1156. https://doi.org/10.1007/s10853-013-7794-7
|
[64]
|
Fan, X. (2013) Mechanical Characterization of Hydroxyapatite, Thermoelectric Materials and Doped Ceria.
|
[65]
|
Tyagi, K., Gahtori, B., Bathula, S., et al. (2015) Crystal Structure and Mechanical Properties of Spark Plasma Sintered Cu2Se: An Efficient Photovoltaic and Thermoelectric Material. Solid State Communications, 207, 21-25.
https://doi.org/10.1016/j.ssc.2015.02.004
|