[1]
|
唐勇, 汪波, 陈明, 等. 高温下的IGBT可靠性与在线评估[J]. 电工技术学报, 2014, 29(6): 17-23.
|
[2]
|
Ji, B., et al. (2015) In Situ Diagnostics and Prognostics of Solder Fatigue in IGBT Modules for Electric Vehicle Drives. IEEE Transactions on Power Electronics, 30, 1535-1543. https://doi.org/10.1109/TPEL.2014.2318991
|
[3]
|
魏克新, 杜明星. 基于集总参数法的IGBT模块温度预测模型[J]. 电工技术学报, 2011(12): 79-84.
|
[4]
|
Košel, V., de Filippis, S., Chen, L., et al. (2013) FEM Simulation Approach to Investigate Electro-Thermal Behavior of Power Transistors in 3-D. Microelectronics Reliability, 53, 356-362. https://doi.org/10.1016/j.microrel.2012.09.002
|
[5]
|
郑利兵, 韩立, 刘钧, 等. 基于三维热电耦合有限元模型的IGBT失效形式温度特性研究[J]. 电工技术学报, 2011(7): 242-246.
|
[6]
|
Lhommeau, T., Perpiñà, X., Martin, C., et al. (2007) Thermal Fatigue Effects on the Temperature Distribution inside IGBT Modules for Zone Engine Aeronautical Applications. Microelectronics Reliability, 47, 1779-1783.
|
[7]
|
Sauveplane, J.B., Tounsi, P., Scheid, E., et al. (2008) 3D Electro-Thermal Investigations for Reliability of Ultra Low on State Resistance Power MOSFET. Microelectronics Reliability, 48, 1464-1467.
|
[8]
|
SEMIKRON IGBT Module Datasheet, SKM50GB12T4. http://www.semikron.com
|
[9]
|
杨世铭, 陶文铨. 传热学[M]. 北京: 高等教育出版社, 2006.
|
[10]
|
汪泉弟, 张淮清. 电磁场[M]. 北京: 科学出版社.
|
[11]
|
Pecht, M.G. and Govind, A. (1997) In Situ Measurements of Surface Mount IC Package Deformations during Reflow Soldering. IEEE Transac-tions on Components, Packaging, and Manufacturing Technology, Part C, 20, 207-212.
https://doi.org/10.1109/3476.649442
|
[12]
|
Hoad, R., Carter, N.J., Herke, D. and Watkins, S.P. (2004) Trends in EM Susceptibility of IT Equipment. IEEE Transactions on Electromagnetic Compatibility, 46, 390-395. https://doi.org/10.1109/TEMC.2004.831815
|
[13]
|
Otiaba, K.C., Okereke, M.I. and Bhatti, R.S. (2014) Numerical Assessment of the Effect of Void Morphology on Thermo-Mechanical Performance of Solder Thermal Interface Material. Applied Thermal Engineering, 64, 51-63.
|
[14]
|
Lai, W., Chen, M., Ran, L., et al. (2015) Low ΔTj Stress Cycle Effects in IGBT Power Module Die-Attach Lifetime Modelling. IEEE Transactions on Power Electronics, 39, 6575-6585.
|