杭州集成电路产业创新生态系统的症结及其治理研究Research on the Problems of Hangzhou Integrated Circuit Industry Innovation Ecosystem and Its Solutions
陈丹宇, 何 熠 下载量: 204 浏览量: 286
现代管理 Vol.13 No.8, August 3 2023, PDF, HTML, XML DOI:10.12677/MM.2023.138127 被引量
产业基金促进企业创新投入的机制研究——以集成电路产业为例The Relationship between Government Industry Funds and the Internal Innovation Input—Evidence from the Integrated Circuit Enterprises
张云柯 下载量: 629 浏览量: 912
金融 Vol.11 No.3, May 12 2021, PDF, HTML, XML DOI:10.12677/FIN.2021.113011 被引量
战略联盟、地理邻近与企业竞争力——基于我国集成电路产业上市公司的实证研究Strategic Alliance, Geographical Proximity and Corporate Competitiveness—Based on Empirical Research of Listed Companies in My Country’s Integrated Circuit Industry
肖 萍 下载量: 421 浏览量: 2,226
现代管理 Vol.11 No.11, November 17 2021, PDF, HTML, XML DOI:10.12677/MM.2021.1111143 被引量
集成电路专业职教本科实践教学模式的探讨Discussion on Practical Teaching Mode for Vocational Education Undergraduate of Integrated Circuit Major
陈 艳 下载量: 143 浏览量: 216 科研立项经费支持
职业教育 Vol.12 No.3, May 23 2023, PDF, HTML, XML DOI:10.12677/VE.2023.123049 被引量
集成电路专业职教本科人才培养模式的探索Exploration on Talent Cultivation Mode for Vocational Education Undergraduate of Integrated Circuit Major
陈 艳, 李世国, 张卫丰 下载量: 331 浏览量: 722 科研立项经费支持
职业教育 Vol.11 No.6, November 15 2022, PDF, HTML, XML DOI:10.12677/VE.2022.116109 被引量
基于工程教育专业认证的微电子科学与工程专业人才培养方案修订Revision of the Training Programs for Microelectronics Science and Engineering Based on the Professional Certification of Engineering Education
杨红姣, 汪 洋, 肖思国, 刘桂东, 胡金勇, 李伯勋 下载量: 264 浏览量: 323 科研立项经费支持
教育进展 Vol.14 No.2, February 22 2024, PDF, HTML, XML DOI:10.12677/AE.2024.142215 被引量