标题:
碲对硫酸铜体系中铜电解的影响Effect of Tellurium on Copper Electrodeposition in Copper Sulfate-Sulfuric Acid System
作者:
李超超, 伍廉奎, 曹华珍, 郑国渠
关键字:
铜, 碲, 电沉积, 循环伏安, 除杂Copper, Tellurium, Electrodeposition, Cyclic Voltammetry, Eliminate
期刊名称:
《Metallurgical Engineering》, Vol.3 No.2, 2016-06-09
摘要:
本文系统研究了碲对硫酸铜体系中电解铜电流效率、结构组成和微观形貌的影响，同时提出一种去除碲的有效方法。研究结果表明，电解液中含有碲离子对铜的结晶取向和形核生长有明显影响。XRD测试结果表明，碲离子的存在使铜的最优生长取向从(220)晶面转变为(111)晶面。光学照片表明碲的存在可显著降低电沉积铜的韧性。扫描电镜照片表明沉积层的晶粒随碲浓度增加而逐渐减小。除碲实验表明，利用铜屑在95℃条件下反应一个小时，可将碲浓度由1 g/L降至20 mg/L，净化后的电解液电解可获得光亮阴极铜。
The influence of tellurium as an impurity during electrodeposition of copper from sulfate solution was investigated. The effect of tellurium concentration on the current efficiency, chemical structure and morphology at macro and micro level was systematically studied. XRD patterns show that the introduction of tellurium can change the preferential orientation of the deposits from (220) plane to (111) plane. And optical images exhibit that tellurium will reduce the tenacity of the elec-trodeposited copper. The eliminating experiment shows that the concentration of tellurium will reduce from 1 g/L to 20 mg/L after reacting 1 h under 95˚C, and bright copper can be obtained from the electrolyte.