高压大功率IGBT器件可靠性研究综述
Review on the Reliability Research of High Power IGBT Devices
摘要: 随着高压直流输电和电力机车等领域的不断发展,高压大功率IGBT器件作为其中重要的电力电子器件,其可靠性问题得到了国内外研究机构的广泛关注。为给高压大功率领域可靠性设计者以及终端用户提供更多高压大功率IGBT器件的可靠性信息,文中阐述了高压大功率IGBT器件可靠性的发展与研究现状。根据高压大功率IGBT器件可靠性研究目的的不同,将可靠性研究分为故障诊断、寿命预测和状态监测三个方面。文中对故障诊断和状态监测的研究方法进行了分析,对于寿命预测模型进行了分类总结以及优缺点对比分析。最后,基于目前高压大功率IGBT器件可靠性的研究方法和内容,提出了可靠性研究未来的挑战和发展趋势。
Abstract: With the development of high-voltage transmission and electric locomotive, the high voltage and high power IGBT device, as the most important power electronic device in those application fields, have been widely concerned by domestic and foreign research institutions on their reliability. To provide more reliability information to reliability designers and end users, this paper reviews the development and research status of high voltage and high power IGBT devices reliability. According to the different research purposes of high voltage and high power IGBT devices, the reliability research is divided into three aspects: fault diagnosis, life prediction and condition monitoring. Then the research methods of fault diagnosis and condition monitoring are analyzed and the life prediction model is classified and summarized and its advantages and disadvantages are compared and analyzed. Finally, based on the current reliability research methods and contents of the high voltage and high power IGBT device, the challenge and developing trend of reliability research in the future are put forward.
文章引用:任斌, 邓二平, 黄永章. 高压大功率IGBT器件可靠性研究综述[J]. 智能电网, 2019, 9(5): 218-226. https://doi.org/10.12677/SG.2019.95024

参考文献

[1] 张经纬. 基于有限元法的压接型IGBT器件单芯片子模组疲劳寿命预测[D]: [硕士论文]. 北京: 华北电力大学, 2018.
[2] 刘爽, 牟龙华, 许旭锋, 郭文明. 电力电子器件故障对微电网运行可靠性的影响[J]. 电力系统保护与控制, 2017, 45(24): 63-70.
[3] Kaminski, N. (2004) Load-Cycle Capability of HiPaks. ABB Appl. Note 5SYA, 2043-01.
[4] Berner, J. (2012) Load-Cycling Capability of HiPak IGBT Modules. ABB Switzerland Ltd. Semicond., Tech. Rep. 5SYA2043-03, Lenzburg.
[5] Bayerer, R., et al. (2008) Model for Power Cycling Lifetime of IGBT Modules—Various Factors Influencing Lifetime. 5th International Conference on Integrated Power Electronics Systems, Nuremberg, 11-13 March 2008, 1-2.
[6] Vogler, B., Herzer, R., Buetow, S., Mayya, I. and Becker, S. (2014) Advanced SOI Gate Driver IC with Integrated V CE-Monitoring and Negative Turn-Off Gate Voltage for Medium Power IGBT Modules. 26th International Symposium on Power Semiconductor Devices & IC’s, Waikoloa, 15-19 June 2014, 1-3.
[Google Scholar] [CrossRef
[7] Busca, C. (2011) Modeling Lifetime of High Power IGBTs in Wind Power Applications—An Overview. International Symposium on Industrial Electronics, Gdańsk, 27-30 June 2011, 1408-1413.
[Google Scholar] [CrossRef
[8] Ciappa, M., Carbognani, F. and Fichtner, W. (2003) Lifetime Prediction and Design of Reliability Tests for High-Power Devices in Automotive Applications. IEEE Transactions on Device & Materials Reliability, 3, 523-528.
[Google Scholar] [CrossRef
[9] 王彦刚, Chamund Dinesh, 李世平, 等. 功率IGBT模块的寿命预测[J]. 机车电传动, 2013(2):13-17.
[10] 李世平, 黄蓉, 奉琴, 等. IGBT模块功率循环能力与可靠性试验[J]. 机车电传动, 2015(3): 15-18.
[11] 周雒维, 周生奇, 孙鹏菊. 基于杂散参数辨识的IGBT模块内部缺陷诊断方法[J]. 电工技术学报, 2012, 27(5): 156-163.
[12] 沈刚, 周雒维, 杜雄, 等. 基于小波奇异熵理论的IGBT模块键合线脱落故障特征分析[J]. 电工技术学报, 2013, 28(6): 165-171.
[13] 周生奇, 周雒维, 孙鹏菊. 基于曲线离散Fréchet距离的风电并网变流器中IGBT模块缺陷诊断方法[J]. 电力自动化设备, 2013, 33(2): 8-13.
[14] 刘宾礼, 刘德志, 唐勇, 等. 基于加速寿命试验的IGBT模块寿命预测和失效分析[J]. 江苏大学学报(自然科学版), 2013, 34(5): 556-563.
[15] 唐勇, 汪波, 陈明, 等. 高温下的IGBT可靠性与在线评估[J]. 电工技术学报, 2014, 29(6): 17-23.
[16] 禹鑫, 杜明星, 窦汝振, 等. IGBT功率模块键合线故障下的温度特性研究[J]. 电力电子技术, 2015, 49(2): 55-57.
[17] Musallam, M. and Johnson, C.M. (2010) Real-Time Compact Thermal Models for Health Management of Power Electronics. IEEE Transactions on Power Electronics, 25, 1416-1425.
[Google Scholar] [CrossRef
[18] 邓二平, 张经纬, 李尧圣, 金锐, 赵志斌, 黄永章. 焊接式IGBT模块与压接型IGBT器件可靠性差异分析[J]. 半导体技术, 2016, 41(11): 801-810+815.
[19] 吴耀辉, 杨焦赟, 魏仁灿. IGBT高频开关电源的故障分析及处理[J]. 电力电子技术, 2009, 43(5): 61-62.
[20] Patil, N., Celaya, J., Das, D., et al. (2009) Precursor Parameter Identification for Insulated Gate Bipolar Transistor (IGBT) Prognostics. IEEE Transactions on Reliability, 58, 271-276.
[Google Scholar] [CrossRef
[21] 韩丽, 罗朋, 汤家升, 史丽萍, 张晓蕾. 基于H桥变流器的IGBT开路故障诊断[J]. 电工技术学报, 2016, 31(16): 163-171.
[22] Zhou, L. and Zhou, S. (2010) Effects of Wire-Bond Lift-Off on Gate Circuit of IGBT Power Modules. 14th International Power Electronics and Motion Control Conference, Ohrid, 6-8 September 2010, T1-45-T1-47.
[Google Scholar] [CrossRef
[23] Onuki, J., Koizumi, M. and Suwa, M. (2000) Reliability of Thick Al Wire Bonds in IGBT Modules for Traction Motor Drives. IEEE Transactions on Advanced Packaging, 35, 428-433.
[Google Scholar] [CrossRef
[24] Xiong, Y., Cheng, X., Shen, Z.J., et al. (2008) Prognostic and Warning System for Power-Electronic Modules in Electric, Hybrid Electric, and Fuel-Cell Vehicles. IEEE Transactions on Industrial Electronics, 55, 2268-2276.
[Google Scholar] [CrossRef
[25] Zhou, S., Zhou, L. and Sun, P. (2013) Monitoring Potential Defects in an IGBT Module Based on Dynamic Changes of the Gate Current. IEEE Transactions on Power Electronics, 28, 1479-1487.
[Google Scholar] [CrossRef
[26] Rodríguez-Blanco, M., Claudio-Sánchez, T.D., et al. (2011) A Failure-Detection Strategy for IGBT Based on Gate-Voltage Behavior Applied to a Motor Drive System. IEEE Transactions on Industrial Electronics, 58, 1625-1633.
[Google Scholar] [CrossRef
[27] 谢东, 葛兴来. 基于残差变化率的单相级联H桥整流器IGBT开路故障诊断[J]. 电工技术学报, 2018, 33(16): 3822-3834.
[28] Xiang, D., Ran, L., Tavner, P., et al. (2012) Condition Monitoring Power Module Solder Fatigue Using Inverter Harmonic Identification. IEEE Transactions on Power Electronics, 27, 235-247.
[Google Scholar] [CrossRef
[29] Held, M., Jacob, P., Nicoletti, G., et al. (1997) Fast Power Cycling Test of IGBT Modules in Traction Application. International Conference on Power Electronics and Drive Systems, Vol. 1, 425-430.
[30] Norris, K.C. and Landzberg, A.H. (1969) Reliability of Controlled Collapse Interconnections. IBM Journal of Research & Development, 13, 266-271.
[Google Scholar] [CrossRef
[31] 张亚玲, 李志刚. 基于加速老化试验的IGBT寿命预测模型研究[J]. 电气传动, 2016, 46(10): 72-75.
[32] Lu, Z.J., Huang, W., Lach, J., et al. (2002) Interconnect Lifetime Prediction under Dynamics Stress for Reliability. Microelectronics, 42, 653-667.
[33] 赖伟, 陈民铀, 冉立, 王学梅, 徐盛友. 老化实验条件下的IGBT寿命预测模型[J]. 电工技术学报, 2016, 31(24): 173-180.
[34] Snook, I., Marshall, J.M. and Newman, R.M. (2003) Physics of Failure as an Integrated Part of Design for Reliability. Annual Reliability and Maintainability Symposium, Tampa, 27-30 January 2003, 46-54.
[35] Kilinski, T.J., Lesniak, J.R. and Sandor, B.I. (1991) Modern Approaches to Fatigue Life Prediction of SMT Solder Joints. In: Lau, J.H., Ed., Solder Joint Reliability: Theory and Applications, Springer, Berlin, Chapter 13, 384-405.
[Google Scholar] [CrossRef
[36] Lu, H., Bailey, C. and Yin, C. (2009) Design for Reliability of Power Electronics Modules. Microelectronics Reliability, 49, 1250-1255.
[Google Scholar] [CrossRef
[37] Pan, T.Y. (1994) Critical Accumulated Strain Energy (Case) Failure Criterion for Thermal Cycling Fatigue of Solder Joints. Journal of Electronic Packaging, 116, 163-170.
[Google Scholar] [CrossRef
[38] Stolkarts, V., Moran, B. and Keer, L.M. (1998) Constitutive and Damage Model for Solders. Electronic Components & Technology Conference, Seattle, 25-28 May 1998, 379-385.
[39] Yang, S., Xiang, D., Bryant, A., et al. (2010) Condition Monitoring for Device Reliability in Power Electronic Converters: A Review. IEEE Transactions on Power Electronics, 25, 2734-2752.
[Google Scholar] [CrossRef
[40] 鲁光祝, 向大为. IGBT功率模块状态监测技术综述[J]. 电力电子, 2011(2): 5-10.
[41] Lehmann, J., Netzel, M., Herzer, R. and Pawel, S. (2003) Method for Electrical Detection of Bond Wirelift-Off for Power Semiconductor. IEEE 15th International Symposium on Power Semiconductor Devices and ICs, Cambridge, 14-17 April 2003, 333-336.
[42] Farokhzad, B. (2000) Method for Early Failure Recognition in Power Semiconductor Modules. US, US 6145107 A.
[43] Patil, N., Das, D., Goebel, K., et al. (2008) Identification of Failure Precursor Parameters for Insulated Gate Bipolar Transistors (IGBTs). International Conference on Prognostics and Health Management, Denver, 6-9 October 2008, 1-5.
[Google Scholar] [CrossRef
[44] Xiong, Y., Cheng, X., Shen, Z.J., et al. (2006) A Prognostic and Warning System for Power Electronic Modules in Electric, Hybrid, and Fuel Cell Vehicles. Industry Applications Conference, IAS Meeting, 8-12 October 2006, 1578-1584.
[Google Scholar] [CrossRef
[45] 苏玉淋. 功率电源中IGBT失效机理及其检测方法的研究[D]: [硕士学位论文]. 西安: 西安理工大学, 2008.
[46] 刘宾礼, 肖飞, 罗毅飞, 汪波, 熊又星. 基于集电极漏电流的IGBT健康状态监测方法研究[J]. 电工技术学报, 2017, 32(16): 183-193.
[47] 李亚萍, 周雒维, 孙鹏菊, 彭英舟, 蔡杰. 基于特定集电极电流下饱和压降的IGBT模块老化失效状态监测方法[J]. 电工技术学报, 2018, 33(14): 3202-3212.
[48] Xiang, D., Ran, L., Tavner, P., et al. (2011) Monitoring Solder Fatigue in a Power Module Using the Rise of Case-above-Ambient Temperature. IEEE Transactions on Industry Applications, 47, 2578-2591.
[Google Scholar] [CrossRef