基本情况
史耀武,北京工业大学教授、博士生导师。负责或承担了德国大众汽车基金会等单位资助的国际合作项目3项, 国家“七五”和“八五”重点科技攻关5项, 973重大基础研究1项,863项目1项,国家自然科学基金课题6项, 北京市自然科学基金及政府项目7项, 国家教委博士点基金课题2项和多项企业委托的技术开发项目。
研究领域
电子封装可靠性、焊接结构强度、超声无损检测
教育背景
1982年 博士,英国 Aston 大学
1964年 学士,西安交通大学
论文发表
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陈振华、史耀武、赵海燕,点焊试件中兰姆波传播的有限元建模及其应用,机械工程学报,2011,47(10),14-18
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陈振华、史耀武、赵海燕、王燕、张宁,微小缺陷的非线性超声检测及其成像技术,声学学报,2010,35(1),9-13
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陈振华、史耀武、赵海燕,超声检测换能器高次谐波的提取与应用,仪器仪表学报,2010,31(7),1547-1551
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杜晶晶、李晓延、史耀武,超声检测涂层厚度小波变换模极大值法的研究,无损检测,2008,30(2),87-90
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陈振华、史耀武、焦标强、赵海燕,薄镀锌钢板点焊超声谐振检测,焊接学报,2008,29(4),101-104
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焦标强、史耀武、史立丰、雷永平,铜/钢异种材料摩擦焊接头强度的超声波检测,无损检测,第27卷,第6期,2005年,286-290页
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焦标强、史耀武、史立丰、雷永平,基于小波包分析的铜/钢异种材料摩擦焊接头质量的超声无损评价,无损检测,第27卷,第8期,2005年,412-415页
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郑祥明、顾向华、史立丰、史耀武,超声兰姆波的时频分析,声学学报,第28卷,第4期,2003年,368-374页
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郑祥明、赵玉珍、史耀武,兰姆波频散曲线的计算,无损检测,第25卷,第2期,2003年,66-68页
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陈建忠、史耀武,超声检测过程的数值模拟,无损检测,第23卷,第5期,2001年,198-201页
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陈建忠、史耀武、史淑,粗晶材料超声检测信号处理,核动力工程, 第21卷,第2期,2000年,183-187页
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Chen Zhenhua, Shi Yaowu, Zhao Haiyan, Ultrasonic
imaging technique of spot weld structure for a high strength galvanized steel
sheet, Journal of Testing and Evaluation, 2009, 37(3), 300-305
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Chen Zhenhua, Shi Yaowu, Biaoqiang Jiao, Zhao
Haiyan, Ultrasonic nondestructive evaluation of spot welds for zinc-coated high
strength steel sheet based on wavelet packet analysis, Journal of Materials
Processing Technology, 2009, 209, 2329-2337
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Zhenhua Chen, Yaowu Shi, Haiyan Zhao, Evaluating
technology of spot weld quality for coated high strength steel sheet based on
ultrasonic guide wave, 2008 IEEE International Ultrasonics Symposium (IUS
2008), Beijing, China, November 2-5, 2008 Proceedings - IEEE Ultrasonics
Symposium, p 406-409, 2008
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Jianzhong Chen, Yaowu Shi, and Shu Shi, Ringing
noise estimation and suppression by high pass filtering and wavelet pachet
transform, Materials Evaluation, Vol.58, No.8, 2000, pp.979-984
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X.M.Zheng, Y.W.Shi, Y.P.Lei and J.Z.Chen,
Non-destructive characterisation of adhesive bond strength by Lamb waves,
Insight, 45(8), 2003, 558-565
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Ning Zhang, Yaowu Shi, Zhidong Xia, Yongping Lei,
Fu Guo, Xiaoyan Li, Investigation on impact strength of the as-soldered Sn37Pb
and Sn3.8Ag0.7Cu solder joints, Journal of Materials Science: Materials in
Electronics, 2009, 20,499-506
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Ning Zhang, Yaowu Shi, Yongping Lei, Zhidong Xia,
Fu Guo, Xiaoyan Li, Effect of thermal aging on impact absorbed energies of
solder joints under high-strain-rate conditions, Journal of Electronic Materials,
2009, 38(10), 2132-2146
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Ning Zhang, Yaowu Shi, Fu Guo, Fuqiang Yang, Study
of the Impact Performance of Solder Joints by High-Velocity Impact Tests,
Journal of Electronic Materials, 2010, 39(12), 2536-2543
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Ning Zhang, Yaowu Shi, Fu Guo, Yongping Lei,
Zhidong Xia, Zhenhua Chen, Li Tian, Comparison of drop performance between the
Sn37Pb and the Sn3.8Ag0.7Cu solder joints subjected to drop test, Journal of
Materials Science: Materials in Electronics, 2011, 22,292-298