基本情况
李军辉，博士，中南大学机电工程学院教授、博士生导师。
研究领域
微/光电子封装超声互连材料冶金基础理论与技术装备研究
论文发表
-
J. Li, L. Han, J. Duan, J. Zhong, Interface
Mechanism of Ultrasonic Flip Chip Bonding, Applied Physics Letters, 2007, 90:
242902. (IF2010=3.820)
-
Junhui Li, Liu Linggang, Deng Luhua, Ma
Bangke, Wang Fuliang, Lei Han, Interfacial microstructures and thermodynamics
of thermosonic Cu-wire bonding, IEEE Electron Device Letters, 2011, 32(10):
1433-1435. (IF2010=2.714)
-
Junhui Li, Liu Linggang, Ma Bangke, Deng
Luhua, Lei Han, Dynamics Features of Cu-Wire Bonding During Overhang Bonding
Process, IEEE Electron Device Letters, 2011, 32(12): 1731-1733. (IF2010=2.714)
-
Li Junhui, Zhang Xiaolong, Liu Linggang,
and Han Lei, Interfacial characteristics and dynamic process of Au-wire and
Cu-wire bonding & overhang bonding in microelectronics packaging, Journal
of Microelectromechanical Systems, 2013, Vol.22, No.3, Jun, pp.560-568.
(IF2011=2.129)
-
Li Jun-Hui, Wang Ruishan, Han Lei, Wang
Fuliang, Long Zhili, HRTEM And X-Ray Diffraction Anylsis Of Au Wire Bonding
Interface In Microelectronics Packaging, Solid State Sciences, 2011, (13)
72-76. (IF2010=1.828)
-
Li Junhui, Deng Luhua, Ma Bangke, and Han
Lei, Investigation of the characteristics of overhang bonding for 3-D stacked
dies in microelectronics packaging, Microelectronics Reliability, 2011, 51:
2236-2242. (IF2010=1.026)
-
Junhui Li, Bangke Ma, Ruishan Wang, Study
on A Cooling System Based on Thermoelectric Cooler for Thermal Management of
High-power LEDs, Microelectronics Reliability, 2011, 51: 2210-2215.
(IF2010=1.026)
-
Junhui Li, Wang Fuliang, Lei Han and Jue
Zhong, Theoretical and Experimental Analyses of Atom Diffusion Characteristics
on Wire Bonding Interfaces, Journal of Physics D: Applied Physics, 2008, 41:
135303. (IF2010=2.200)
-
Junhui Li, Lei Han, Jue Zhong, Observations
on HRTEM features of thermosonic flip chip bonding interface, Materials Chemistry
and Physics, 2007, 106(2-3): 457-460. (IF2010=2.325)
-
Li Junhui, Wang Ruishan, He Hu, Wang
Fuliang, Han Lei, Zhong Jue, The Law of Ultrasonic Energy Conversion in
Thermosonic Flip Chip Bonding Interface, Microelectronic Engineering, 2009, 86:
2063-2066. (IF2010=1.488)
-
Junhui Li, Lei Han, Jue Zhong, Power and
Interface Features of Thermosonic Flip Chip Bonding, IEEE Transactions on
Advanced Packaging, 2008, 30(3):442-446. (IF2010=1.276)
-
Li Jun-Hui, Duan Ji-an, Han Lei, Zhong Jue,
Microstructural characteristics of Au/Al bonded interfaces, Materials
Characterization, 2007, 58: 103-107. (IF2010=1.496)
-
Junhui Li, Lei Han, Jue Zhong,
Short-Circuit Diffusion of Ultrasonic Bonding Interfaces in Microelectronic
Packaging, Surface and Interface Analysis, 2008, 40(5): 953-957. (IF2010=1.247)
-
Ji-an Duan, Junhui Li*, Lei Han, Jue Zhong,
Interface features of ultrasonic flip chip bonding and reflow soldering in
microelectronic packaging, Surface and Interface Analysis, 2007, 39: 783-786.
(IF2010=1.247)
-
Li Junhui, Zhang Xiaolong, Liu Linggang,
Deng Luhua, and Han Lei, Effects of Ultrasonic Power and Time on Bonding
Strength and Interfacial Atomic Diffusion During Thermosonic Flip-Chip Bonding,
IEEE Transation on Components, Packaging and Manufacturing Technology, In press,
Feb 9 2012, DOI: 10.1109/TCPMT.2012.2183601