基本情况
李军辉,中南大学机电工程学院,博士,教授、博导。2002年至今,在高性能复杂制造国家重点实验室、中南大学机电工程学院(机械工程一级学科、机械设计及理论国家重点学科)从事微/光电子封装超声互连材料冶金基础理论与技术装备研究,目前,已主持3项国家自然科学基金面上项目(No.50675227,50975292,51275536)、承担国家973课题2项(No.2003CB716202、No.2009CB724203)、国家自然重大基金项目1项(No.50390064)、国家重大专项1项(2009ZX02038-001),获得2008年教育部“新世纪优秀人才支持计划”
(NCET-08-0575)。
研究领域
从事微/光电子封装超声互连材料冶金基础理论与技术装备研究
荣誉奖励
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湖南省科技进步奖一等奖1项(排1)
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湖南省优秀学术论文一等奖2项(排1)
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湖南省青年骨干教师
论文发表
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李军辉,韩雷,钟掘,超声键合界面的微观结构特性,中国机械工程,2005,16(4): 341-344
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李军辉,韩雷,钟掘,Ni-Al超声楔焊键合分离界面的结构特性及演变规律,焊接学报,2005,26(4): 5-8
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J. Li, L. Han, J. Duan, J.
Zhong, Interface Mechanism of Ultrasonic Flip Chip Bonding, Applied
Physics Letters, 2007, 90: 242902. (IF2010=3.820)
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Junhui Li, Liu Linggang, Deng
Luhua, Ma Bangke, Wang Fuliang, Lei Han, Interfacial microstructures and
thermodynamics of thermosonic Cu-wire bonding, IEEE Electron Device
Letters, 2011, 32(10): 1433-1435. (IF2010=2.714)
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Junhui Li, Liu Linggang, Ma
Bangke, Deng Luhua, Lei Han, Dynamics Features of Cu-Wire Bonding During
Overhang Bonding Process, IEEE Electron Device Letters, 2011, 32(12):
1731-1733. (IF2010=2.714)
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Li Junhui, Zhang Xiaolong,
Liu Linggang, and Han Lei, Interfacial characteristics and dynamic process of
Au-wire and Cu-wire bonding & overhang bonding in microelectronics packaging, Journal
of Microelectromechanical Systems, 2013, Vol.22, No.3, Jun, pp.560-568.
(IF2011=2.129)
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Li Jun-Hui, Wang Ruishan, Han
Lei, Wang Fuliang, Long Zhili, HRTEM And X-Ray Diffraction Anylsis Of Au Wire
Bonding Interface In Microelectronics Packaging, Solid State Sciences,
2011, (13) 72-76. (IF2010=1.828)
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Li Junhui, Deng Luhua, Ma
Bangke, and Han Lei, Investigation of the characteristics of overhang bonding
for 3-D stacked dies in microelectronics packaging, Microelectronics
Reliability, 2011, 51: 2236-2242. (IF2010=1.026)
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Junhui Li, Bangke Ma, Ruishan
Wang, Study on A Cooling System Based on Thermoelectric Cooler for Thermal
Management of High-power LEDs, Microelectronics Reliability, 2011, 51:
2210-2215. (IF2010=1.026)
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Junhui Li, Wang Fuliang,
Lei Han and Jue Zhong, Theoretical and Experimental Analyses of Atom Diffusion
Characteristics on Wire Bonding Interfaces, Journal of Physics D: Applied
Physics, 2008, 41: 135303. (IF2010=2.200)
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Junhui Li, Lei Han, Jue
Zhong, Observations on HRTEM features of thermosonic flip chip bonding
interface, Materials Chemistry and Physics, 2007, 106(2-3):
457-460. (IF2010=2.325)
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Li Junhui, Wang Ruishan, He
Hu, Wang Fuliang, Han Lei, Zhong Jue, The Law of Ultrasonic Energy Conversion
in Thermosonic Flip Chip Bonding Interface, Microelectronic Engineering,
2009, 86: 2063-2066. (IF2010=1.488)
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Junhui Li, Lei Han, Jue
Zhong, Power and Interface Features of Thermosonic Flip Chip Bonding, IEEE
Transactions on Advanced Packaging, 2008, 30(3):442-446. (IF2010=1.276)
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Li Jun-Hui, Duan
Ji-an, Han Lei, Zhong Jue, Microstructural characteristics of Au/Al bonded
interfaces, Materials Characterization, 2007, 58: 103-107. (IF2010=1.496)
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Junhui Li, Lei Han,
Jue Zhong, Short-Circuit Diffusion of Ultrasonic Bonding Interfaces in
Microelectronic Packaging, Surface and Interface Analysis, 2008, 40(5):
953-957. (IF2010=1.247)
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Ji-an Duan, Junhui Li*,
Lei Han, Jue Zhong, Interface features of ultrasonic flip chip bonding and
reflow soldering in microelectronic packaging, Surface and Interface Analysis,
2007, 39: 783-786. (IF2010=1.247)
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Li Junhui, Zhang Xiaolong,
Liu Linggang, Deng Luhua, and Han Lei, Effects of Ultrasonic Power and Time on
Bonding Strength and Interfacial Atomic Diffusion During Thermosonic Flip-Chip
Bonding, IEEE Transation on Components, Packaging and Manufacturing
Technology, In press, Feb 9 2012,
DOI: 10.1109/TCPMT.2012.2183601