硬质合金环研磨加工中的材料去除率分析

Analysis of Material Removal Rate in Lapping of the Hard Alloy Rings

摘要: 非接触式流体静压密封环是轴封式核主泵核心零部件。采用预变形平面研磨加工技术可以实现密封环低成本高效加工，但在变形以及加工过程的材料去除控制对最终面形精度非常关键。本文通过平面研磨实验对硬质合金环的材料去除特性开展了研究。研究发现，磨粒粒径、研磨压力及研磨盘转速对材料去除率和表面粗糙度都有显著的影响。当选用2 µm的金刚石磨粒且抛光盘转速为30 r/min时，材料去除率和表面粗糙度分别可以达到2.27 µm/min和21.3 nm。此外，通过偏心研磨实验，证明重心位置变化确实可以影响密封环上各点的材料去除率变化。

Abstract: The non-contact hydrostatic mechanical seal ring is the key element of the coolant pump for shaft seal. Pre-deformation plane lapping method is a cost-effective and efficient method for machining the seal rings. The accuracy of the end face of seal ring is dominated by the accuracy of pre-defor- mation and the uniformity of the material removal rate in lapping process. In this paper, the re-moval characteristics of cemented carbide are researched by plane lapping experiments. The re-sults show that the abrasive size, pressure and rotation speed of lapping plate obviously affect the material removal rate and roughness. When the diamond abrasive of 2 μm is used and the rotation speed of lapping plate reaches 30 r/min, the material removal rate and the roughness are 2.27 µm/min and 21.3 nm respectively. Moreover, eccentric pressure in lapping process through ad-justing the position of mass center of weight can influence material removal rate.