高斯表面在互连线参数提取中的应用

Application of Gaussian Surface to the Parameter Extraction of Interconnection Line

摘要: 随着集成电路特征尺寸的进一步缩小，互连线RC延迟引起的可靠性问题正成为影响芯片性能的主要因素。受制作工艺影响，互连线截面并非规则矩形，而RC延迟问题会因此加剧，采用数值方法分析、计算这种互连线的寄生参数必须首先描述粗糙表面。集成电路中互连线的表面高度并不容易测量，为此，本文提出了使用高斯函数来描述粗糙表面，实验数据表明将该表面应用于互连线参数计算结果较为准确。

Abstract: With the further shrinkage of the feature size of integrated circuit, the reliability problem arising from RC delay of interconnection line becomes the main factor affecting the performance of chip. Affected by the manufacturing technology, the cross section of interconnection line is not regular rectangle, and RC delay is thus intensified. The analysis and computation of the parasitic parameter of such interconnection line using numerical method must firstly describe the rough surface. The surface height of interconnection line in the integrated circuit is not easy to measure. To this end, the paper proposes using Gaussian function to describe the rough surface. The experimental data indicate that the application of such surface to the parameters of interconnection line realizes accurate computation result.