铜/金刚石复合材料的研究进展

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铜/金刚石复合材料的研究进展
Research Progress of Copper/Diamond Composites

DOI: 10.12677/MS.2023.1312117, PDF, 下载: 149 浏览: 311 科研立项经费支持
作者: 梁兴宇, 龙骋宇, 甘达桓, 洪伟浩, 李安敏, 覃伟沛^*：广西大学资源环境与材料学院，广西南宁
关键词: 铜基复合材料；制备方法；作用机理； Copper Matrix Composite； Preparation Method； Action Mechanism

摘要: 近年来，随着5G技术的不断发展，其核心部件的散热问题越来越引起了重视。传统的铜基材料已经不能满足需求，而金刚石的热导率可高达2000 W/(m•K)，并且密度轻，因此将其制备成铜/金刚石复合材料既能充分利用金刚石高热导率及低密度的特点，又能将铜的良好导电能力与之相结合，开发出具有良好散热能力的电子器件。本文详细介绍了铜/金刚石复合材料的研究进展，包括制备方法和作用机理。此外，还总结了当前研究中需要解决的问题。

Abstract: In recent years, with the continuous development of 5G technology, the heat dissipation problem of its core components has attracted more and more attention. Traditional copper-based materials can no longer meet the demand, while the thermal conductivity of diamond can be as high as 2000 W/(m•K), and the density is light, so its preparation into copper/diamond composites can make full use of the characteristics of diamond’s high thermal conductivity and low density, but also can combine the good electrical conductivity of copper, to develop electronic devices with good heat dissipation ability. This paper describes in detail the research progress of copper/diamond composites, including the preparation method and mechanism of action. In addition, the problems that need to be solved in the current research are summarized.

文章引用：梁兴宇, 龙骋宇, 甘达桓, 洪伟浩, 李安敏, 覃伟沛. 铜/金刚石复合材料的研究进展[J]. 材料科学, 2023, 13(12): 1043-1054. https://doi.org/10.12677/MS.2023.1312117

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