游离磨料多线切割单晶硅尾部裂片异常的研究

Researches on the Wafer-Break in the Tail Position during the Free Abrasive Wire Saw

摘要: 在游离磨料多线切割工艺中，钢线切割到单晶与树脂板结合处(尾部)的裂片为常见异常，一直得不到有效的解决，本文分析了裂片位置的受力情况，指出切割浆料粘度高、浆料聚集效应以及钢线的振动为此异常的主要原因并给出了解决该异常的主要措施。

Abstract: In the free abrasive wire cutting process, wafer break when the steel wire cutting to ingot and resin plate junction position is common abnormalities; this problem has been can’t get effective solution; this paper analyses the force situation of junction position; gathering points out that the high slurry viscosity, slurry gathering and wire vibration are the main reason and gives the measures to solve the abnormalities.