面向仪器应用的电阻式湿度传感器：结构、工艺与研究进展

Resistive Humidity Sensors for Instrumentation Applications: Structure, Fabrication, and Research Progress

摘要: 针对精密仪器与工业设备环境适应性的需求，湿度是影响其长期性能与可靠性的关键参量。具备高精度、宽范围、快速响应及长期稳定的湿度传感器，对于保障仪器信号质量、实现内部微环境监控及防护核心元件至关重要。电阻式湿度传感器凭借敏感材料丰富、制备工艺兼容性强、易于与读出电路集成等优势，在工业分析、医疗监护及便携式仪器系统中应用广泛。从器件层面出发，系统综述了湿度电阻式传感器的工作机理、材料体系、结构设计及制备工艺的发展现状，着重强调了“结构–工艺–性能”之间的关联机制。文章重点归纳了电极结构(梳状、指叉、微纳电极)、基底选择(陶瓷、硅、柔性基底)、湿敏薄膜结构(多孔、纳米复合、梯度结构)以及典型制备工艺(PVD、溶胶凝胶、印刷、MEMS微加工)，并结合仪器设备需求分析了其工程应用场景。最后，总结当前面临的技术挑战并展望未来发展趋势，旨在为新型电阻式湿度传感器在仪器设备中的选型、集成与应用提供技术参考。文章重点比较了不同敏感材料在柔性基底上的结合工艺及其对传感器滞后性与灵敏度的影响，并对未来的多功能集成方向进行了展望。

Abstract: For precision instruments and industrial equipment requiring environmental adaptability, humidity is a critical parameter affecting long-term performance and reliability. Humidity sensors featuring high accuracy, wide measurement range, rapid response, and long-term stability are essential for ensuring signal quality, enabling internal microenvironment monitoring, and protecting core components. Resistive humidity sensors, leveraging advantages such as diverse sensitive materials, strong process compatibility, and ease of integration with readout circuits, find extensive applications in industrial analysis, medical monitoring, and portable instrument systems. From a device perspective, this systematic review covers the working principles, material systems, structural designs, and fabrication processes of resistive humidity sensors, emphasizing the interrelated mechanisms between “structure, process, and performance”. The paper systematically categorizes electrode structures (comb, interdigitated, micro/nano electrodes), substrate selections (ceramic, silicon, flexible substrates), humidity-sensitive film architectures (porous, nanocomposite, gradient structures), and typical fabrication techniques (PVD, sol-gel, printing, MEMS microfabrication). It further analyzes their engineering applications based on instrumentation requirements. Finally, it summarizes current technical challenges and outlines future development trends, aiming to provide technical guidance for selecting, integrating, and applying novel resistive humidity sensors in instrumentation. The paper specifically compares bonding processes for different sensing materials on flexible substrates and their impact on sensor hysteresis and sensitivity, while also projecting future directions toward multifunctional integration.