P型赝三元半导体掺Al块体热电材料的热电性能
Thermoelectric Performance of P-Type Pseudoternary Semiconductor Doped with Al Bulk Thermoelectric Materials
DOI: 10.12677/MS.2024.143025, PDF,   
作者: 李宏飞:哈尔滨师范大学物理与电子工程学院,黑龙江 哈尔滨
关键词: 热电材料P型赝三元半导体 Thermoelectric Materials P-Type Pseudoternary Semicon-ductor Al
摘要: 本文采用湿混热压法制备了P型赝三元半导体掺Al块体热电材料,研究结果表明,掺Al后,在材料中出现了较多的高导电区和高导热区,从而导致电导率和热导率增高;由于金属Al的高载流子浓度也会相应提高材料的整体载流子浓度,同时掺Al会引入更多的界面缺陷,从而引起载流子散射效应增强,散射因子的降低且载流子浓度的升高共同导致Seebeck系数的降低。
Abstract: In this paper, the P-type pseudoternary semiconductor doped with Al block thermoelectric material is prepared by wet mixing hot pressing method. The results show that there are more high conductivity and high thermal conductivity regions in the material after mixing Al, which leads to the increase of electrical conductivity and thermal conductivity. Because the high carrier concentration of metal Al will correspondingly increase the overall carrier concentration of the material, at the same time, Al doping will introduce more interface defects, which will lead to an enhanced carrier scattering effect. The decrease of scattering factor and the increase of carrier concentration together lead to the decrease of Seebeck coefficient.
文章引用:李宏飞. P型赝三元半导体掺Al块体热电材料的热电性能[J]. 材料科学, 2024, 14(3): 217-222. https://doi.org/10.12677/MS.2024.143025

参考文献

[1] Yamashita, O., Tomiyoshi, S. and Makita, K. (2003) Bismuth Telluride Compounds with High Thermoelectric Figures of Merit. Journal of Applied Physics, 93, 368-374. [Google Scholar] [CrossRef
[2] 丁正. Bi2Te3基热电材料的热压法制备及性能研究[D]: [硕士学位论文]. 北京: 北京有色金属研究总院, 2011: 27-32.
[3] 卢波辉, 赵新兵, 倪华良. 热压法制备Bi2Te3基热电材料的组织与性能[J]. 兵器材料科学与工程, 2004, 27(3): 13-16.
[4] Yang, J.Y., Aizawa, T., Yamamoto, A. and Ohta, T. (2000) Thermoelectric Properties of N-Type (Bi2Se3)x(Bi2Te3)1 − x Prepared by Bulk Mechanical Alloying and Hot Pressing. Journal of Alloys & Compounds, 312, 326-330. [Google Scholar] [CrossRef
[5] 王珏翎, 宋少伟. Al掺杂Bi2Te(2.7)Se(0.3)合金的热电性能[J]. 金属热处理, 2014, 39(11): 52-55.
[6] 刘瑞雪, 胡建民. Al2O3掺杂N型赝三元半导体复合材料的微观结构与热电性能[J]. 哈尔滨师范大学自然科学学报, 2022, 38(1): 44-47.
[7] 吕途. SnTe和Bi2Te3基热电材料的性能优化研究[D]: [博士学位论文]. 北京: 北京科技大学, 2021: 5-6.
[8] 成泓宣, 胡建民. N型赝三元半导体掺Sn复合材料的微观结构与热电性能[J]. 哈尔滨师范大学自然科学学报, 2023, 39(2):54-56.
[9] 潘春光. P型Gd掺杂赝三元半导体致冷材料的微观结构与热电性能[D]: [硕士学位论文]. 哈尔滨: 哈尔滨师范大学, 2021: 39-40.