基于弧形排列的梯形微通道数值模拟研究

Numerical Investigation on Arc-Arranged Trapezoidal Microchannels

摘要: 鉴于梯形截面微通道散热器在水力和热工性能耦合优化方面的研究较少，同时传统微通道散热器非直线流道结构与温度均匀性结合研究的不足，本文在7种排列弧度的基础上对3种不同结构设计的梯形微通道进行层流单相流体流动的数值分析，设计了长宽高为10 mm × 10 mm × 2 mm的热沉物理模型，以水为冷却介质，发热功率80 W的硅芯片为热源，构建三维固–流热交换耦合数学模型，分析排列弧度、倒置方式和随动方式对芯片换热性能和温度均匀性的影响。研究表明：微通道向上排列的布局能促进芯片温度扩散，降低芯片最大温度；IT构型的倒置方式和CBT构型的随动方式在对流换热系数和温度均匀性等方面均更优。其中：IT构型较PBT构型，Nu和h_ave最高均提升1.5%，T_heat,max最大降低4.7 K，温度均匀性方面最大改善20%；CBT构型较PBT构型，Nu最高提升1.5%，h_ave最大提升1.4%，T_heat,max最大降低4.6 K，温度均匀性方面最大改善19%；该研究为微通道散热器中通道排列布局设计和截面设计提供了理论依据和数值支撑。

Abstract: Given the limited research on the coupled optimization of hydraulic and thermal performance in trapezoidal cross-sectional microchannel heat sinks, as well as the insufficient integration of non-straight flow channel structures with temperature uniformity in conventional microchannel heat sinks, this paper presents a numerical analysis of laminar single-phase fluid flow in trapezoidal microchannels with three different structural designs based on seven arrangement arcs. A physical model of a heat sink with dimensions of 10 mm × 10 mm × 2 mm (length × width × height) was developed. Using water as the cooling medium and a silicon chip with a heat generation power of 80 W as the heat source, a three-dimensional solid-fluid conjugate heat transfer model was established. The effects of arrangement arc, inversion method, and following method on the heat transfer performance and temperature uniformity of the chip were analyzed. The results indicate that an upward arrangement of microchannels promotes chip temperature diffusion and reduces the maximum chip temperature. The inversion method of the IT configuration and the following method of the CBT configuration exhibit superior performance in terms of convective heat transfer coefficient and temperature uniformity. Specifically, compared with the PBT configuration, the IT configuration achieves maximum increases of 1.5% in both Nusselt number and average convective heat transfer coefficient, a maximum reduction of 4.7 K in maximum chip temperature, and a maximum improvement of 20% in temperature uniformity. Compared with the PBT configuration, the CBT configuration achieves a maximum increase of 1.5% in Nusselt number, a maximum increase of 1.4% in average convective heat transfer coefficient, a maximum reduction of 4.6 K in maximum chip temperature, and a maximum improvement of 19% in temperature uniformity. This study provides theoretical and numerical support for the design of channel arrangement layouts and cross-sectional geometries in microchannel heat sinks.