CDIO与项目化教学融合实践——以“电子产品开发”课程为例

Practice of Integrating CDIO with Project-Based Learning—A Case Study of “Electronic Product Development” Course

摘要: CDIO工程教育模式与国内项目化教学在理念上高度契合，但在课程引进实践中往往被割裂对待。本文以常州工学院与英国赫特福德大学合作办学项目“电子产品开发”课程为案例，探讨CDIO产品全生命周期框架与本土项目化教学相融合的路径。课程以“数字情绪登记器”为项目载体，采用3周集中授课模式，第1周为理论教学，第2至3周开展项目实践，要求学生完成从电路设计、仿真、PCB制造到产品外形设计与3D打印的完整流程，通过双师协同、A/B班错峰、备选方案容错等策略实现本土化适配，并构建个人报告、小组成果与阶段日志相结合的多元评价体系。首轮77名学生全部及格，3D打印外壳完成率100%，但个人技术报告得分率仅47.2%、PCB一次成功率约50%，暴露出工程文档写作和制造工艺方面的能力短板。文章最后从项目载体设计、过程容错机制和评价闭环三方面提炼对国内同类课程建设的启示。

Abstract: CDIO (Conceive-Design-Implement-Operate) engineering education is highly compatible with project-based learning widely adopted in China, yet the two are often treated separately in imported courses. This paper explores the integration of the CDIO product lifecycle framework with domestic project-based learning, using the “Electronic Product Development” course in the Sino-foreign cooperative program between Changzhou Institute of Technology and the University of Hertfordshire as a case study. The course employs a three-week intensive model: one week of theoretical instruction followed by two weeks of project practice. Centered on a “Digital Emotional Register” product, students complete the full development process from circuit design, simulation, and PCB fabrication to enclosure design and 3D printing. Localization strategies include dual-faculty collaboration, A/B group rotation, and fallback plans for PCB failures. A multi-dimensional assessment system combines individual reports, group deliverables, and stage logbooks. Data from 77 students shows a 100% pass rate and 100% completion of 3D-printed enclosures, while individual report scores (47.2%) and first-attempt PCB success rate (50%) reveal weaknesses in technical writing and manufacturing skills. The paper concludes with implications for domestic project-based curriculum development in three aspects: project design, process fault tolerance, and assessment closure.