产教融合赋能青年技能人才培养的机制与困境——基于上海集成电路硬科技领域的混合方法研究

Mechanisms and Dilemmas of Industry-Education Integration in Empowering Young Skilled Talents Cultivation—A Mixed-Methods Study of Shanghai’s Integrated Circuit Hard Technology Sector

摘要: 产教融合是推动教育、科技、人才一体化发展、破解人才培养与产业需求“两张皮”问题的核心战略。已有研究多停留在政策文本与文献概括层面，对“培养目标与产业需求错位”等判断缺乏一手数据支撑，问题分析趋于宽泛。文章以上海集成电路硬科技领域为研究场景，构建“需求–培养(供给)–协同”分析框架，综合采用课程大纲文本分析、毕业生问卷调查与企业用人方深度访谈的混合方法：编码分析8所高校246份培养方案与核心课程大纲，回收386份2023~2025届毕业生有效问卷，并对28家集成电路企业的36位人力资源负责人与技术主管进行半结构化访谈。研究发现：其一，课程供给侧存在实践学分占比偏低(均值24.1%)、内容更新周期偏长(均值3.4年)、企业真实项目进课堂比例不足三成等结构性问题；其二，57.0%的毕业生感知课程内容滞后于岗位实际，深度参与产教融合的毕业生在岗位胜任力、人岗匹配度、首年留任率上均显著优于普通培养组(Cohen’s d = 0.82)；其三，企业用人方认为最突出的能力短板是质量与工艺规范意识(4.18分)和真实工况问题排查调试能力(4.12分)，而非专业理论基础(2.71分)；回归分析表明，深度产教融合参与、顶岗实习时长与企业导师指导显著正向预测岗位胜任力(R² = 0.437)。在此基础上，研究提出“三链耦合、闭环反馈”的产教融合机制模型，并从课程动态更新、真实项目牵引、多元协同保障三方面给出可操作策略，为上海及类似产业集聚区的集成电路等硬科技领域技能人才培养提供实证依据与机制参考。

Abstract: Industry-education integration is a core strategy for promoting the integrated development of education, science and technology, and talent, and for resolving the “two disconnected systems” between talent cultivation and industrial demand. Existing studies mostly remain at the level of policy texts and literature summaries, lacking first-hand data support for judgments such as “misalignment between cultivation objectives and industrial demand”, and problem analysis tends to be broad. Taking the hard technology field of integrated circuits in Shanghai as the research scenario, this paper constructs a “demand - cultivation (supply) - collaboration” analytical framework and comprehensively adopts a mixed-methods approach combining textual analysis of course syllabi, a questionnaire survey of graduates, and in-depth interviews with employers: it codes and analyzes 246 cultivation programs and core course syllabi from 8 universities, collects 386 valid questionnaires from graduates of the 2023~2025 cohorts, and conducts semi-structured interviews with 36 HR managers and technical supervisors from 28 integrated circuit enterprises. The findings are as follows: First, on the curriculum supply side, there are structural problems such as a low proportion of practical credits (mean 24.1%), a long content update cycle (mean 3.4 years), and a proportion of real enterprise projects entering the classroom of less than 30%. Second, 57.0% of graduates perceive that course content lags behind actual job requirements, and graduates who deeply participated in industry-education integration significantly outperform the ordinary cultivation group in job competence, person-job matching, and first-year retention rate (Cohen’s d = 0.82). Third, employers consider the most prominent capability shortcomings to be awareness of quality and process specifications (4.18 points) and the ability to troubleshoot and debug under real working conditions (4.12 points), rather than professional theoretical foundation (2.71 points). Regression analysis shows that deep participation in industry-education integration, duration of on-the-job internship, and enterprise mentor guidance significantly positively predict job competence (R² = 0.437). On this basis, this paper proposes a “three-chain coupling, closed-loop feedback” industry-education integration mechanism model, and provides operational strategies from three aspects: dynamic curriculum updating, real project traction, and multi-stakeholder collaborative support, offering empirical evidence and mechanism-related insights for cultivating skilled talents in integrated circuits and other hard-tech fields in Shanghai and similar industrial cluster regions.