基于等刚度原理的LTCC基板密集孔区域研究

Study on Dense Hole Region of LTCC Substrate Based on Equal Stiffness Theory

摘要: 由于低温共烧陶瓷(LTCC：low temperature co-fired ceramic)基板上大片的密集孔区域的存在，对LTCC基板进行有限元仿真分析时出现模型网格数量极大，且网格质量较差等问题，导致仿真分析结果误差较大，计算时间长。本文针对上述问题，采用等刚度原理对密集孔区域进行等效，得到LTCC基板密集孔区域的简化模型及等效弹性模量，并对等效前后的模型进行有限元分析，验证等效的正确性。密集孔区域的等效研究达到了简化模型、提高计算精度和减少计算时间的目的，为以后具有相似特征的LTCC基板的有限元分析奠定基础。

Abstract: Due to the presence of a large area of dense holes in the LTCC (low temperature co-fired ceramic) substrate, the number of LTCC substrate model meshes is very large and the mesh quality of the LTCC substrate is very poor during finite element simulation analysis, which leads to the error of the large simulation analysis, and the long calculation time. In this paper, in order to solve the above problems, the equivalent stiffness principle is used to obtain the equivalent area of dense holes. The simplified model and the equivalent elastic modulus of dense holes in the LTCC substrate are obtained. The models before and after the equivalent are validated by the finite element analysis to make sure the simplified model is right. The equivalent study of the dense hole area achieves the purpose of simplifying the model, improving the calculation precision and reducing the calculation time, and lays the foundation for the finite element analysis of the LTCC substrate with similar characteristics in the future.