多线切割中不同钢丝对硅片表面损伤的研究

Study on the Wafer Damaged Surface Layer in Multi-Wire Sawing with Different Kinds of Steel Wires

摘要: 使用游离磨料多线切割技术切割的硅片，切割后的损伤层深度是决定后续研磨去除量的关键因素，直钢丝和螺旋钢丝是游离磨料多线切割中广泛使用的两种不同的钢线，本文通过测试粗糙度情况及研磨腐蚀后硅片边缘的线痕残留情况，分析两种不同钢线对硅片损伤层的影响，为后续研磨加工提供理论依据。

Abstract: Wafer slices by the free abrasive wire cutting method, the damage dept is a key factor for the lap-ping progress; straight steel wire and spiral steel wire are two different kinds of wires that are widely used in the free abrasive wire cutting method. This paper studies the roughness and the residual saw mark at edge of wafer after grinding and the corrosion, analyzes the effect on silicon wafer damage layer with these two different kinds of steel wires and provides the theoretical basis for the lapping progress.