氧化铝基板导热性能数值分析

Numerical Analysis of Thermal Conductivity of Alumina Substrate

摘要: 高效的热传递是确保电子器件的正常运作、延长寿命、和提高效率的关键因素。当前的重要课题之一，就是怎样提高电子器件的导热性能。本文通过对氧化铝基板热传导方程解析结果的数值模拟，从理论上预测了结构参数变化对系统导热性能的影响。本结果为电子器件的高效热传递结构设计提供了理论基础。

Abstract: Efficient heat transfer is the key factor to ensure the normal operation, prolong the life and improve the efficiency of electronic devices. One of the most important tasks is how to improve the thermal conductivity of electronic devices. In this paper, we theoretically predict the influence of structural parameters on the thermal conductivity of the system by numerical simulation of the analytical results of the thermal conductivity equation of the alumina substrate. The results provide a theoretical basis for the design of high-efficiency heat transfer structure of electronic devices.