微波加热金属导体的仿真研究
Simulation Study on Microwave Heating of Metallic Conductor
DOI: 10.12677/MOS.2021.101007, PDF,    科研立项经费支持
作者: 梁少荣, 蔡达健, 陈浩彬, 孙延一, 林建辉*：电子科技大学中山学院材料与食品学院，广东 中山
关键词: COMSOL；铜电极；微波加热；表面粗糙度；温度场；COMSOL； Copper Electrode； Microwave Heating； Surface Roughness； Temperature Field
摘要: 基于有限元软件COMSOL Multiphysics，建立了置于谐振腔的铜电极的电磁场与热传导双向耦合模型。在解析铜电极热源的基础上，通过加热位置的参数化扫描，确定了铜电极在腔体中加热效率最高的最佳位置。其次，研究了铜表面粗糙度与温度之间的关系，发现表面粗糙度在0~10 μm时温度急剧递增，在10~50 μm时温度平缓，稳定在2250℃~2264℃之间。该温度已达到激发液下等离子体条件。
Abstract: Based on finite element software COMSOL Multiphysics, a bidirectional model of electromagnetic field and thermal conductivity of copper electrode that placed in the resonant cavity is established. The optimal position that has the highest thermal efficiency is confirmed by parametric sweep of coordinates based on analyzing its heat source. In addition, the relation between electrode’s surface roughness and its temperature is researched. It is found that the temperature increases drastically with the surface roughness of 0~10 μm. It becomes relatively stable at 2250˚C~2264˚C of 10~50 μm, which is able to stimulate to generate in-liquid plasma.
文章引用：梁少荣, 蔡达健, 陈浩彬, 孙延一, 林建辉. 微波加热金属导体的仿真研究[J]. 建模与仿真, 2021, 10(1): 58-69. https://doi.org/10.12677/MOS.2021.101007

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