基于ABAQUS的划片损伤过程研究

Study on Scratch Damage Process Based on ABAQUS

摘要: 砷化镓解理加工是通过解理划片产生初始损伤，然后经过解理裂片获得解理面，因此不同的解理划片工艺参数对后续的解理裂片起到至关重要的作用。本文基于ABAQUS开展对砷化镓划片加工的有限元分析，分析划片损伤过程，以及不同工艺参数下划片过程中切削力的变化。结果表明：入刀时因未得到缓冲导致入刀口的损伤情况较大，划片深度增加一倍，划片力大小增幅达到100%左右，而划片速度增加一倍对划片力的大小几乎不影响，推断出划片载荷对划片损伤作用较大；从仿真结果来看在3 um、60 mm/s工艺参数下划片效果最佳。

Abstract: GaAs cleavage processing produces initial damage through cleavage slicing, and then obtains cleavage surface through cleavage slicing. Therefore, different cleavage slicing process parameters play a crucial role in subsequent cleavage slicing. Based on ABAQUS, the finite element analysis of gallium arsenide scribing is carried out to analyze the scribing damage process and the change of cutting force in the scribing process under different process parameters. The results show that the damage of the knife edge is relatively large due to the lack of buffer when entering the knife, the scoring depth is doubled, and the scoring force is increased by about 100%, while the doubling of the scoring speed has little effect on the scoring force. It is concluded that the scoring load plays a greater role in the scoring damage; From the simulation results, the scribing effect is the best under the process parameters of 3 um and 60 mm/s.