碳化硅陶瓷超声振动运动轨迹以及磨削力建模

Modeling of Ultrasonic Vibration Trajectory and Grinding Force of Silicon Carbide Ceramics

摘要: 为了研究在磨削过程中超声振动对于加工的影响，现对单颗磨粒运动轨迹进行了数学理论模型以及仿真，并且在单颗粒运动学仿真的基础上，建立了超声振动磨削碳化硅的力学模型，结果表明：随着超声振动的加入，单位时间内磨粒运动轨迹长度也随之增加；在所选工艺参数范围内，高砂轮转速以及高超声振动频率能有效降低磨削力，小进给速度和小磨削切深度也能有效降低磨削力，加入了超声振动之后，磨削力下降幅度最高达到21.1%。

Abstract: In order to study the influence of ultrasonic vibration on machining during the grinding process, a mathematical theoretical model and simulation were conducted on the motion trajectory of a single abrasive particle. Based on the kinematic simulation of a single particle, a mechanical model for ul-trasonic vibration grinding of silicon carbide was established. The results showed that with the ad-dition of ultrasonic vibration, the length of the motion trajectory of the abrasive particle per unit time also increased; Within the selected process parameter range, high grinding wheel speed and high ultrasonic vibration frequency can effectively reduce grinding force. Small feed rate and cut-ting depth can also effectively reduce grinding force. After adding ultrasonic vibration, the maxi-mum reduction in grinding force can reach 21.1%.