双配体铜配合物合成及湿敏性能研究
Synthesis and Humidity Sensing Performance of Dual-Ligand Cu Complex
DOI: 10.12677/ojns.2024.124087, PDF,    科研立项经费支持
作者: 冯学英*, 胡芮彬, 李 挺, 龚霄芸, 方子双, 谢宜萱, 王秋童, 李如茵, 殷艳艳#:南开大学滨海学院环境科学与工程系,天津
关键词: 双配体配合物湿敏传感器Dual-Ligand Cu Complex Humidity Sensor
摘要: 本工作以3-噻吩丙二酸为主配体,以3-氰基吡啶为辅助配体,采用简单的挥发法制备了一例双配体铜配合物Cu-TCP。该配合物具有二维网格结构,且网格上含有大量亲水原子(N和S),有利于吸附环境中的水分子。进一步以Cu-TCP为敏感材料组装了阻抗型湿敏传感器,初步探究了其湿敏特性。结果表明,基于Cu-TCP的湿敏传感器件显示了良好的感湿性能。
Abstract: In this work, a dual-ligand Cu complex Cu-TCP was prepared using a simple volatilization method using 3-thiophene malonic acid as the main ligand and 3-cyanopyridine as the auxiliary ligand. This complex has a two-dimensional grid structure and contains a large number of hydrophilic atoms (N and S) on the grid, which is beneficial for adsorbing water molecules from the environment. Furthermore, an impedance-type humidity sensor was prepared using Cu-TCP as the humidity sensitive material, and the humidity sensing characteristics were preliminarily explored. The results indicate that the humidity sensor based on Cu-TCP exhibits good humidity sensing performance.
文章引用:冯学英, 胡芮彬, 李挺, 龚霄芸, 方子双, 谢宜萱, 王秋童, 李如茵, 殷艳艳. 双配体铜配合物合成及湿敏性能研究[J]. 自然科学, 2024, 12(4): 761-765. https://doi.org/10.12677/ojns.2024.124087

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