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Chen, J., Zhang, C., Wang, J., et al. (2015) Thermodynamic Description, Diffusivities and Atomic Mobilities in Binary Ni-Os System. Calphad, 50, 118-125. https://doi.org/10.1016/j.calphad.2015.06.001

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• 标题: 薄膜中的扩散与应力模型Models of Diffusion and Stress in Thin Films

  作者: 林冰, 戴钟保, 高梦滢, 王江涌

  关键字: 扩散, 扩散系数, 扩散致应力, 应力致扩散Diffusion, Diffusion Coefficient, Diffusion-Induced Stress, Stress-Induced Diffusion

  期刊名称: 《Material Sciences》, Vol.6 No.6, 2016-11-30

  摘要: 扩散会产生应力，而产生的或内禀的应力又会影响扩散，这在薄膜材料中表现的尤为突出。本文介绍了常见的几个扩散模型和应力模型，并通过热力学的方法推导出了应力条件下的扩散方程。随后采用有限元差分方法模拟了不同应力模型下的扩散分布。 Diffusion of atoms in the materials can cause stress, and the produced and/or intrinsic stress may influence the diffusion process, which is more pronounced in the thin films. In this paper, some common diffusion and stress models are summarized and the diffusion equations under stress are deduced based on the thermodynamics. The diffusion profiles with different stress models are then simulated by the finite difference method.