|
[1]
|
Lee, H., Kim, D., Jeong, H. and Kim, K.H. (2010) Chemical Mechanical Polishing of a Ti-Si-N Nanocomposite and AFM Study on Its Nanostructure. Journal of the Korean Physical Society, 57, 845-849. [Google Scholar] [CrossRef]
|
|
[2]
|
Wang, Y., Chen, Y. and Zhao, Y. (2015) Chemical Mechanical Planarization of Silicon Wafers at Natural Ph for Green Manufacturing. International Journal of Precision Engineering and Manufacturing, 16, 2049-2054. [Google Scholar] [CrossRef]
|
|
[3]
|
Choe, J.H., Kim, J.S., Ahn, D.W., Jung, E.S. and Pyo, S.G. (2023) Determination of Particle Size Distribution in Oxide Abrasive Slurry after Chemical Mechanical Polishing Process Using Raman Spectroscopy. Electronic Materials Letters, 19, 350-358. [Google Scholar] [CrossRef]
|
|
[4]
|
Aida, H., Takeda, H. and Doi, T. (2021) Analysis of Mechanically Induced Subsurface Damage and Its Removal by Chemical Mechanical Polishing for Gallium Nitride Substrate. Precision Engineering, 67, 350-358. [Google Scholar] [CrossRef]
|
|
[5]
|
Mu, Q., Jin, Z., Han, X., Yan, Y., Zhang, Z. and Zhou, P. (2021) Effects of Slurry Ph on Chemical and Mechanical Actions during Chemical Mechanical Polishing of YAG. Applied Surface Science, 563, Article ID: 150359. [Google Scholar] [CrossRef]
|
|
[6]
|
Wang, X., Gao, H., Deng, Q., Wang, J., Chen, H. and Yuan, J. (2022) Effect of Wetting Characteristics of Polishing Fluid on the Quality of Water-Dissolution Polishing of KDP Crystals. Micromachines, 13, Article 535. [Google Scholar] [CrossRef] [PubMed]
|
|
[7]
|
Abdullah, A., Saleemi, A.S. and Anisur-Rehman, M. (2013) Comparative Study of Nano Crystalline Ceria Synthesized by Different Wet-Chemical Methods. Journal of Superconductivity and Novel Magnetism, 27, 273-276. [Google Scholar] [CrossRef]
|
|
[8]
|
Seo, J., Kim, K., Kang, H. and Babu, S.V. (2022) Perspective—Recent Advances and Thoughts on Ceria Particle Applications in Chemical Mechanical Planarization. ECS Journal of Solid State Science and Technology, 11, Article ID: 084003. [Google Scholar] [CrossRef]
|
|
[9]
|
Zhang, Z., Guo, L., Cui, J., Wang, B., Kang, R. and Guo, D. (2016) Nanoscale Solely Amorphous Layer in Silicon Wafers Induced by a Newly Developed Diamond Wheel. Scientific Reports, 6, Article No. 35269. [Google Scholar] [CrossRef] [PubMed]
|
|
[10]
|
Kang, H., Katoh, T., Kim, S., Paik, U., Park, H. and Park, J. (2004) Effects of Grain Size and Abrasive Size of Polycrystalline Nano-Particle Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing. Japanese Journal of Applied Physics, 43, L365-L368. [Google Scholar] [CrossRef]
|
|
[11]
|
Xu, N., Lin, Y., Luo, Y., Huo, Y., Gao, K., Gao, Z., et al. (2025) Effect of Surfactants with Different Ionizing Properties on Dispersion Stability and PCMP Properties of CeO2 Nanoparticle Polishing Slurry. Ceramics International, 51, 856-864. [Google Scholar] [CrossRef]
|
|
[12]
|
Sihag, N., Kala, P. and Pandey, P.M. (2017) Analysis of Surface Finish Improvement during Ultrasonic Assisted Magnetic Abrasive Finishing on Chemically Treated Tungsten Substrate. Procedia Manufacturing, 10, 136-146. [Google Scholar] [CrossRef]
|