基于DEMATEL-ISM与ANP模型的半导体供应链弹性影响因素研究

Research on the Influencing Factors of Semiconductor Supply Chain Resilience Based on DEMATEL-ISM and ANP Models

摘要: 当前关于半导体供应链弹性影响因素的研究十分有限，针对这一现状，本文采用了基于DEMATEL-ISM与ANP模型的综合性方法对半导体供应链弹性影响因素进行研究。首先，本文筛选出包括准备能力、响应能力、恢复能力和学习能力在内的4个半导体供应链弹性影响因素一级指标，同时引入15个相应的二级指标，以此构建半导体供应链弹性评价体系。最后，结合实证研究，以某半导体上市企业为例，运用DEMATEL-ISM方法，研究半导体行业中影响供应链弹性的各因素之间的关系，并使用ANP方法对各二级指标进行权重评定。通过这一系列分析，本文成功识别出影响该企业供应链弹性最根本的影响因素及关键指标，为半导体企业在增强供应链弹性方面提供理论指导与实践参考。

Abstract: The current research on the influencing factors of semiconductor supply chain resilience is relatively limited. To response to this issue, this study employs a comprehensive approach based on the DEMATEL-ISM and ANP models. Initially, four primary indicators of semiconductor supply chain resilience are identified, including preparedness, responsiveness, recovery, and learning capabilities, along with 15 corresponding secondary indicators to construct an evaluation system for semiconductor supply chain resilience. Through empirical research, taking a semiconductor company as the research object, the DEMATEL-ISM method is used to analyze the relationships among the influencing factors of semiconductor supply chain resilience. Subsequently, the ANP method is applied to evaluate the weights of the secondary indicators, identifying the most fundamental influencing factors and key indicators affecting the supply chain resilience of the company, which provides theoretical guidance and practical references for semiconductor companies to enhance their supply chain resilience.