单磨粒划擦蓝宝石表面残余应力仿真

Simulation of Residual Stress on Sapphire Surface Induced by Single Abrasive Grain Scratching

摘要: 本文以蓝宝石材料作为研究对象，使用有限元分析软件ABAQUS进行单颗磨粒划擦蓝宝石仿真，通过不同磨粒形状、磨粒直径、切入深度以及切入速度的正交试验，并以加工表面的最大残余应力以及残余应力均值作为评价指标，通过极差分析得出磨粒形状对于表面残余应力的影响最大，切入深度次之，切入速度影响最小，进而得出最佳参数组合为磨粒形状为三棱锥形、磨粒直径为1 μm、切入深度为0.2 μm、切入速度为30 m/s。

Abstract: This study focuses on sapphire as the research material and uses the finite element analysis software ABAQUS to simulate the scratching of sapphire by a single abrasive grain. Orthogonal experiments were conducted varying abrasive grain shape, diameter, penetration depth, and speed, with maximum residual stress and average residual stress on the processed surface as evaluation criteria. Range analysis showed that abrasive grain shape has the greatest impact on surface residual stress, followed by penetration depth, while penetration speed has the least effect. The optimal parameter combination is determined by triangular pyramidal grain shape, 1 μm diameter, 0.2 μm penetration depth, and 30 m/s penetration speed.