电子设备热管理研究及优化方案

Thermal Management Research and Optimization Scheme for Electronic Devices

摘要: 本研究针对高功率密度和设备小型化背景下的电子设备热管理问题，提出了一种基于新型导热材料和多物理场耦合的优化方案。通过理论分析、实验验证和数值模拟相结合，评估了不同热管理策略的有效性。研究结果表明，采用石墨烯导热复合材料显著提升了设备的散热效率。本研究为电子设备的热设计提供了新的思路和解决方案。

Abstract: This study addresses the thermal management challenges faced by electronic devices in the context of high power density and miniaturization. A thermal management optimization scheme based on novel thermal materials and multiphysics coupling is proposed. Through a combination of theoretical analysis, experimental validation, and numerical simulation, the effectiveness of different thermal management strategies is evaluated. The results show that the use of graphene-based thermal composites significantly improves heat dissipation efficiency. This study provides new insights and solutions for the thermal design of electronic devices.