硅铝合金研磨与抛光加工有限元仿真分析
Finite Element Simulation Analysis of Grinding and Polishing Process of Silicon-Aluminum Alloy
DOI: 10.12677/mos.2025.145469, PDF,   
作者: 马富军*:上海理工大学机械工程学院,上海;李 欢:河南工程学院外语学院,河南 郑州
关键词: 硅铝合金研抛加工摩擦系数有限元仿真表面形貌材料去除Silicon-Aluminum Alloy Grinding and Polishing Friction Coefficient Finite Element Simulation Surface Morphology Material Removal
摘要: 随着精密加工技术的不断发展,硅铝合金在航空航天、汽车制造等领域的应用日益广泛。文章基于ABAQUS有限元分析软件,采用ABAQUS/Explicit模块对硅铝合金的研磨抛光加工过程进行了仿真分析,重点研究了不同摩擦系数对硅铝合金表面形貌、材料去除量和剩余应力的影响。通过建立硅铝合金部件、弹性基体和磨粒的有限元模型,模拟了不同摩擦系数下的研抛加工过程。研究结果表明,摩擦系数对硅铝合金的变形程度和最大残余应力具有显著影响;摩擦系数的增加使得材料的塑性变形加剧,且最大残余应力逐渐增大。同时,摩擦系数对表面形貌的影响在较高摩擦系数下趋于饱和,表明摩擦系数对表面质量的影响逐渐减弱。等效塑性应变的分析结果显示,摩擦系数的增大增强了磨粒与工件之间的接触作用力,从而提高了材料的去除量,但在摩擦系数进一步增大的情况下,其增效作用逐渐减弱。本研究为优化硅铝合金研抛加工中的工艺参数提供了理论依据,有助于提高加工效率和表面质量。
Abstract: With the continuous development of precision machining technology, the application of silicon-aluminum alloy has become increasingly widespread in fields such as aerospace and automotive manufacturing. Based on ABAQUS finite element analysis software, this paper uses the ABAQUS/Explicit module to perform simulation analysis of the grinding and polishing process of silicon-aluminum alloy, focusing on the influence of different friction coefficients on the surface morphology, material removal rate, and residual stress of silicon-aluminum alloy. By establishing finite element models of the silicon-aluminum alloy component, elastic matrix, and abrasive particles, the grinding and polishing process under different friction coefficients was simulated. The results show that the friction coefficient has a significant impact on the degree of deformation and maximum residual stress of the silicon-aluminum alloy; increasing the friction coefficient intensifies the plastic deformation of the material and gradually increases the maximum residual stress. Additionally, the effect of the friction coefficient on the surface morphology tends to saturate at higher friction coefficients, indicating that the influence of the friction coefficient on surface quality gradually diminishes. The analysis of equivalent plastic strain shows that an increase in the friction coefficient enhances the contact force between the abrasive particles and the workpiece, thereby increasing the material removal rate. However, as the friction coefficient continues to increase, its effect on material removal gradually weakens. This study provides a theoretical basis for optimizing the process parameters in the grinding and polishing of silicon-aluminum alloy, contributing to improvements in machining efficiency and surface quality.
文章引用:马富军, 李欢. 硅铝合金研磨与抛光加工有限元仿真分析[J]. 建模与仿真, 2025, 14(5): 1201-1209. https://doi.org/10.12677/mos.2025.145469

参考文献

[1] 薛洪明, 金洙吉, 史卓颖. 单晶金刚石机械研磨与化学机械抛光工艺[J]. 纳米技术与精密工程, 2015(2): 102-107.
[2] 刘帅伟, 关春龙, 鲁云祥, 等. 金刚石半导体衬底研磨抛光技术研究现状及展望[J]. 硬质合金, 2025, 42(1): 64-79.
[3] Huo, Y., Niu, Y., Sun, Z., Li, Y. and Niu, J. (2024) Surface/Subsurface Damage Mechanisms and Inhibition Strategies in Machining of Hard and Brittle Materials: A Systematic Review. Surfaces and Interfaces, 54, Article ID: 105088. [Google Scholar] [CrossRef
[4] 石亦平, 周玉蓉. ABAQUS有限元分析实例详解[M]. 北京: 机械工业出版社, 2006.
[5] 马晓峰. ABAQUS 6.11中文版有限元分析从入门到精通[M]. 北京: 清华大学出版社, 2013.
[6] Bibby, T.F.A., Adams, J.A., Holland, K., Krulik, G.A. and Parikh, P. (1997) CMP Coo Reduction: Slurry Reprocessing. Thin Solid Films, 308, 538-542. [Google Scholar] [CrossRef
[7] Du, T., Tamboli, D., Luo, Y. and Desai, V. (2004) Electrochemical Characterization of Copper Chemical Mechanical Planarization in KIO3 Slurry. Applied Surface Science, 229, 167-174. [Google Scholar] [CrossRef
[8] Liu, Y., Zhang, K., Wang, F. and Di, W. (2003) Investigation on the Final Polishing Slurry and Technique of Silicon Substrate in ULSI. Microelectronic Engineering, 66, 438-444. [Google Scholar] [CrossRef
[9] 魏家威, 石霄鹏, 冯振宇. 应变率相关的橡胶本构模型研究[J]. 高压物理学报, 2022, 36(2): 105-115.