AI赋能背景下《集成电路封装技术》课程教学改革研究

Research on the Teaching Reform of the “Integrated Circuit Packaging Technology” Course under the Background of AI Empowerment

摘要: 随着人工智能(Artificial Intelligence, AI)技术在教育领域的快速渗透，传统工科课程的教学模式面临深刻转型。《集成电路封装技术》作为电子信息类专业的重要课程，其知识体系高度依赖产业演进与技术创新，传统教学手段难以满足新时代高素质应用型人才培养需求。本文以人工智能技术为切入点，结合教学实践，从课程内容重构、教学资源建设、课堂互动优化与智能化评价等方面出发，提出AI赋能的教学改革框架。通过引入知识图谱、图像识别辅助实验、虚拟仿真平台与智能分析系统，有效提升了学生的学习兴趣、工程意识与综合能力。教学实践表明，该改革方案在教学效果、学生满意度与教学效率等方面具有显著成效，对推动工科课程智能化教学具有良好示范意义。

Abstract: With the rapid penetration of Artificial Intelligence (AI) technology in the field of education, the teaching mode of traditional engineering courses is facing a profound transformation. As an important course in electronic information specialties, the knowledge system of Integrated Circuit Packaging Technology is highly dependent on industrial evolution and technological innovation, and the traditional teaching methods are difficult to meet the needs of the new era of high-quality application-oriented talent training. This paper takes artificial intelligence technology as the entry point, combines teaching practice, and proposes an AI-enabled teaching reform framework from the aspects of course content reconstruction, teaching resources construction, classroom interaction optimization and intelligent evaluation. Through the introduction of knowledge mapping, image recognition-assisted experiments, virtual simulation platform and intelligent analysis system, students’ learning interest, engineering awareness and comprehensive ability have been effectively enhanced. Teaching practice shows that the reform program has significant results in teaching effect, student satisfaction and teaching efficiency, and is a good model for promoting intelligent teaching of engineering courses.