晶圆搬运机械臂运动建模与逆动力学控制仿真

Motion Modeling and Inverse Dynamics Control Simulation of Wafer Handling Robotic Arm

摘要: 晶圆搬运机械臂是半导体生产设备的重要组成部分，针对晶圆搬运机械臂在高精度轨迹跟踪和快速响应方面的不足，本文围绕其传动方案与控制问题展开研究。首先，综合比较多种传动方案在启动负载、布置紧凑性及洁净性能等方面的特性后，优选带传动作为机械臂的传动方案，以有效降低前端关节惯量并满足洁净环境下的晶圆搬运需求。然后，利用SolidWorks建立机械臂的三维模型，采用拉格朗日方法建立机械臂的动力学模型并推导逆动力学方程，在此基础上设计相应的逆动力学控制律。最后，在Simulink平台上搭建晶圆搬运机械臂仿真系统，对典型轨迹跟踪工况进行仿真验证。仿真结果表明，所提出的传动方案与控制方法就具有较好的轨迹跟踪精度和动态响应性能，为晶圆搬运机械臂的工程设计与优化提供了参考。

Abstract: The wafer handling robotic arm is a key component of semiconductor production equipment. To address the shortcomings of the wafer transport robotic arm in high-precision trajectory tracking and fast response, this paper focuses on its drive system and control issues. First, after comprehensively comparing various drive schemes in terms of startup load, compactness, and cleanliness performance, the belt drive is selected as the preferred drive system for the robotic arm. This choice effectively reduces the inertia of the front joints and meets the wafer handling requirements in clean environments. Next, a three-dimensional model of the robotic arm is established using SolidWorks, and the dynamic model of the arm is derived using the Lagrange method to formulate the inverse dynamics equations. Based on this, the corresponding inverse dynamics control law is designed. Finally, a simulation system for the wafer handling robotic arm is built on the Simulink platform, and typical trajectory tracking conditions are simulated for verification. The simulation results show that the proposed drive system and control method provide good trajectory tracking accuracy and dynamic response performance, offering a reference for the engineering design and optimization of wafer handling robotic arms.