AI背景下高职集成电路技术专业校企协同育人模式及课程优化策略研究
Research on School-Enterprise Collaborative Education Model and Curriculum Optimization Strategy of Higher Vocational Integrated Circuit Technology Major under the Background of AI
摘要: 在人工智能驱动集成电路产业深刻变革的背景下,高职集成电路技术专业面临人才培养与产业快速迭代需求脱节的严峻挑战。本文系统分析了AI背景下产业对人才知识、能力与素养的新要求,揭示了当前高职集成电路技术专业在校企协同育人及课程体系构建等方面存在的问题。为此,构建了“双主体协同–全流程渗透–技术赋能”的校企协同育人模式,并设计了“基础通识 + 专业核心 + AI融合 + 实践创新”的四维课程体系。实践表明,该方案有效提升了学生的复合型技术技能与岗位适应能力,实现了人才培养与产业需求的精准对接。
Abstract: Against the backdrop of the profound transformation driven by artificial intelligence (AI) in the integrated circuit industry, the higher vocational integrated circuit technology major faces severe challenges due to the disconnection between talent cultivation and the rapidly evolving demands of the industry. This paper systematically analyzes the new requirements of the industry for personnel knowledge, skills, and literacy under the AI context, and reveals existing problems in the current school-enterprise collaborative education and curriculum system construction for this major in higher vocational education. Consequently, a school-enterprise collaborative education model characterized by “Dual-Subject Collaboration, Whole-Process Integration, and Technology Empowerment” is constructed. Furthermore, a four-dimensional curriculum system consisting of “Foundational General Knowledge + Professional Core + AI Integration + Practical Innovation” is designed. Practice has shown that this approach effectively enhances students’ compound technical skills and job adaptability, achieving precise alignment between talent cultivation and industry needs.
文章引用:卫丽超, 常刚. AI背景下高职集成电路技术专业校企协同育人模式及课程优化策略研究[J]. 教育进展, 2026, 16(1): 1664-1669. https://doi.org/10.12677/ae.2026.161226

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