基于ANSYS Workbench半导体激光器封装热特性分析
Analysis of Thermal Characteristics of Semiconductor Laser Packaging Based on ANSYS Workbench
摘要: 通过对半导体激光器热特性的理论分析，使用ANSYS Workbench软件，模拟分析单管半导体激光器芯片温度和热流分布，输出功率为10 W时，传统c-mount封装芯片温度为66.393℃，热阻为4.6 K/W。通过在热沉与激光器芯片间添加一层高热导率的石墨烯，增加热流扩散面积，使芯片温度下降到55.587℃，热阻3.5 K/W，散热效果明显，计算得到最大输出功率从15.4 W提升到18.5 W，通过计算得知，其输出功率提升了20%。
Abstract: Based on the theoretical analysis of the thermal characteristics of semiconductor lasers, the model of c-mount packaging is established by using ANSYS Workbench software. The temperature and heat flux distribution of single-tube semiconductor laser chips are simulated and analyzed. When the output power is 10 w, the temperature of traditional c-mount packaging chips is 66.393˚C, and thermal resistance is 4.6 k/w. By adding a layer of graphene with high thermal conductivity be-tween the heat sink and the laser chip, the heat flux diffusion area is increased; the temperature of the chip is reduced to 55.587˚C; the thermal resistance is 3.5 k/w; and the heat dissipation effect is obvious. The maximum output power is increased from 15.4 w to 18.5 w. It is found that the output power is increased by 20%.
文章引用：曹伟冬, 冯源, 晏长岭, 郝永芹, 李洋, 闫昊, 张家斌, 贾慧民, 吴胤禛. 基于ANSYS Workbench半导体激光器封装热特性分析[J]. 现代物理, 2018, 8(4): 232-238. https://doi.org/10.12677/MP.2018.84025

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