基于微弯曲法的微梁力学性能测试

Mechanical Properties Test of Micro-Beam Based on Micro-Bending Method

摘要: 针对微梁结构的MEMS器件，基于微力传感探针模块、Femto Tools微操纵模块、CCD光学显微摄像头搭建的微弯曲法力学测试系统，采用微弯曲法，实现了对某SOI基“扭梁 + 悬臂梁”结构的微梁力学性能测试，提出测试系统自身形变所引起的系统误差的消除方法，通过建立微梁的力学模型，结合实测数据计算出该微梁的弹性模量为152.62 GPa，为微器件的设计仿真提供实测参数。

Abstract: For the micro-beam structure MEMS device, based on the micro-force sensing probe module, Femto Tools micro-manipulation module, CCD optical micro-camera built micro-bending mechanical test system, using the micro-bending method, a certain SOI-based “torsion beam-Micro-beam” mechanical properties test has been realized. Furthermore, the method of eliminating the system error caused by the deformation of the test system is proposed. By establishing the mechanical model of the micro-beam and with the measured data, the elastic modulus of the micro-beam is calculated to be 152.62 GPa, which provides the measured parameters for the design and simula-tion of the micro-device.