基于数值模拟的单晶硅切削加工表面质量研究

Study on Surface Quality of Machined Single Crystal Silicon Based on Numerical Simulation of Cutting Process

摘要: 为了探究不同加工参数与单晶硅切削加工表面质量之间的关系，开展了不同切削深度、切削速度、刀具角度等加工参数下的单晶硅切削数值模拟。分别分析了单晶硅材料在刀具切削下的变形、切屑形成和应力行为等潜在机制；分析单晶硅切削加工参数对切削过程的影响，并揭示其规律。结果表明，随着切削深度的增大，加工表面明显地看出材料在去除过程中的撕裂及残留，加工表面变差。切削速度超过某一临界值时，塑性变形增强导致材料流动剧烈，以至于导致材料微裂纹形成和扩展。随着刀具负前角度变化，刀具的挤压效应增大，材料撕裂严重。选择适当的切削深度、切削速度、刀具角度等加工参数可以显著提高切削表面的质量和精度，为单晶硅切削加工工艺的优化提供了重要的理论基础和参考。

Abstract: In order to explore the relationship between different machining parameters and the surface qual-ity of monocrystalline silicon cutting, numerical simulations of monocrystalline silicon cutting were carried out under different machining parameters such as cutting depth, cutting speed, and tool angle. Analyze the potential mechanisms of deformation, chip formation, and stress behavior of monocrystalline silicon materials under tool cutting, respectively; analyze the influence of cutting parameters on the cutting process of monocrystalline silicon and reveal their patterns. The results indicate that as the cutting depth increases, the tearing and residue of the material during the re-moval process are clearly visible on the machined surface, and the machined surface deteriorates. When the cutting speed exceeds a certain critical value, the enhanced plastic deformation leads to severe material flow, resulting in the formation and propagation of microcracks in the material. As the negative rake angle of the tool changes, the squeezing effect of the tool increases and the mate-rial tears severely. Choosing appropriate cutting depth, cutting speed, tool angle and other pro-cessing parameters can significantly improve the quality and accuracy of the cutting surface, providing important theoretical basis and reference for the optimization of monocrystalline silicon cutting process.