基于热流固耦合的接触网绝缘子低温清洗技术研究

Research on Low Temperature Cleaning Technology for Contact Line Insulators Based on Thermal Solid Coupling

摘要: 针对接触网绝缘子在零度以下低温环境下清洗困难的问题，提出了水冲洗 + 热风吹扫的低温清洗技术。采用ANSYS对绝缘子的表面流场、温度场及应力场进行了热流固耦合计算，得到了绝缘子表面温度分布、应力分布等计算结果，评估了热风风速对绝缘子表面带来的影响，分析了在不同环境温度下热风温度对绝缘子表面所带来的热应力影响。仿真结果表明热风风速对绝缘子结构强度影响非常小；在相同的温差条件下，当环境温度越低时，绝缘子表面的应力值越高，出现破损的可能性越大；当温差达到60℃时，绝缘子表面的最大应力值超过了材料抗弯强度，有出现裂纹的风险。通过热流固耦合计算得到了绝缘子在低温环境下进行清洗作业所需安全温差，为接触网绝缘子低温清洗提供了高效、安全的解决方案。

Abstract: A low-temperature cleaning technique of water flushing and hot air blowing is proposed to address the difficulty of cleaning contact wire insulators in low temperature environments below zero degrees. ANSYS was used to perform thermal fluid solid coupling calculations on the surface flow field, temperature field, and stress field of insulators, obtaining the calculation results of temperature distribution and stress distribution on the insulator surface. The influence of hot air velocity on the insulator surface was evaluated, and the thermal stress effect of hot air temperature on the insulator surface at different environmental temperatures was analyzed. The simulation results show that the influence of hot air velocity on the structural strength of insulators is very small. Under the same temperature difference conditions, the lower the ambient temperature, the higher the stress value on the surface of the insulator, and the greater the possibility of damage. When the temperature difference reaches 60˚C, the maximum stress value on the surface of the insulator exceeds the bending strength of the material, which poses a risk of cracking. The safe temperature difference required for cleaning insulators in low-temperature environments was calculated through thermal fluid solid coupling, providing an efficient and safe solution for low-temperature cleaning of contact network insulators.