大功率LED散热封装用高导热石墨/铝复合散热基板研究进展
Research Progress of High Thermal Conductivity Graphite/Aluminum Composite Heat Dissipation Substrate for High Power LED Heat Dissipation Packaging
摘要: 本文综述了大功率LED散热技术的发展现状与挑战，特别是针对高导热石墨/铝复合散热基板的研究进展。随着LED功率密度的提高，散热问题成为制约其性能的关键因素。高导热热解石墨(PG)因其卓越的导热性能被视为理想的热管理材料，但其低强度和难焊接性限制了其广泛应用。本文分析了PG与金属复合材料的制备方法及其在大功率LED散热中的应用潜力，并探讨了高发射率辐射散热涂层作为解决密闭环境散热问题的新思路。此外，还介绍了微弧氧化技术在构建多功能导热/辐射散热涂层方面的前景，为解决高功率器件的散热难题提供了新方向。
Abstract: This paper reviews the current status and challenges of LED thermal management, particularly focusing on the research progress of high thermal conductivity graphite/aluminum composite thermal management substrates. As the power density of LEDs increases, thermal management becomes a critical factor limiting their performance. High thermal conductivity pyrolytic graphite (PG) is considered an ideal thermal management material due to its excellent thermal conductivity, but its low strength and difficulty in welding limit its widespread application. This paper analyzes the preparation methods of PG-metal composite materials and their potential application in LED thermal management, and discusses the new idea of using high emissivity radiation heat dissipation coating to solve the heat dissipation problem in enclosed environments. In addition, it introduces the prospect of microarc oxidation technology in building multifunctional thermal/radiation heat dissipation coatings, providing a new direction for solving the heat dissipation problem of high-power devices.
文章引用：边燕飞, 王若甫, 杨艳红, 王宇光, 田峰, 卢立东, 易文清. 大功率LED散热封装用高导热石墨/铝复合散热基板研究进展[J]. 材料科学, 2024, 14(10): 1520-1528. https://doi.org/10.12677/ms.2024.1410165

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