基于冗余通信机制的LED驱动芯片可靠性提升设计

Reliability Improvement Design of LED Driver Chip Based on Redundant Communication Mechanism

摘要: 随着LED显示技术发展，市场对LED显示可靠性提出了更高要求，现有的内封IC的LED驱动芯片有串联、并联、断点续传等多种驱动方式，在LED显示上出现连续多个坏点、或间断坏点时，会出现大片黑的现象。本文提出一种冗余通信机制提升LED驱动芯片在级联过程中的可靠性，在出现虚焊、坏点时，能够尽可能保证传输通路的完整性。与现有的LED驱动芯片级联方式相比，本文提出的设计结合了串行、并行级联特性，可以在连续多个坏点下，保证其余LED驱动芯片的正常工作。在每个LED驱动芯片上设置地址，并增加多种校验功能，提升了可靠性。仿真测试验证结果证明了系统的可靠性。

Abstract: With the development of LED display technology, the market has put forward higher requirements for the reliability of LED display. The existing LED driver chips of inner sealed IC have a variety of driving modes, such as series, parallel, breakpoint continuation and so on. When there are continuous or intermittent bad points on the LED display, there will be a large black phenomenon. This paper proposes a redundant communication mechanism to improve the reliability of LED driver chip in the cascading process, which can ensure the integrity of the transmission path as much as possible in the case of faulty soldering and bad points. Compared with the existing LED driver chip cascading mode, the design proposed in this paper combines the characteristics of serial and parallel cascading, which can ensure the normal operation of other LED driver chips under the continuous multiple bad points. The address is set on each LED driver chip, and a variety of verification functions are added to improve the reliability. The results of simulation test verify the reliability of the system.