嵌入式系统中间件和软总线综述
An Overview of Middleware and Soft Bus in Embedded Systems
DOI: 10.12677/etis.2025.24022, PDF,    科研立项经费支持
作者: 杨鹏飞, 郑天洋, 郭 恒, 王 泉：西安电子科技大学计算机科学与技术学院，陕西 西安
关键词: 嵌入式软件；软件中间件；软总线；分布式系统；Embedded Software； Software Middleware； Soft Bus； Distributed Systems
摘要: 嵌入式中间件与软总线作为现代分布式系统的核心基础设施，对于降低系统开发复杂度、实现异构环境互操作至关重要。文章系统梳理了应用服务器、远程过程调用(RPC)、消息中间件、容器编排平台等主流中间件以及新兴软总线技术的发展脉络。通过从系统完整性、环境适配性、对分布式架构与大模型等新兴技术的支撑性三个维度进行深入对比，揭示了国内外技术方案的差异化格局。研究发现，国际中间件凭借成熟的生态与标准化设计在系统完整性上具备优势，而国内中间件在国产化浪潮驱动下，依托云原生架构实现了跨越式发展，尤其在服务治理、本土软硬件生态适配及新兴场景应用方面形成了独特竞争力。展望未来，嵌入式中间件与软总线技术正朝着系统完整性更高、适配性更强，并与云原生、人工智能等前沿技术深度融合的方向演进，将成为构筑智能制造、智慧城市等未来应用场景的泛在连接与智能协同的核心技术底座。
Abstract: As the core infrastructure of modern distributed systems, embedded middleware and soft bus play a crucial role in reducing system development complexity and enabling interoperability across heterogeneous environments. This paper systematically reviews the development of mainstream middleware technologies—including application servers, remote procedure calls (RPC), message-oriented middleware, and container orchestration platforms—as well as emerging soft bus technologies. From three perspectives—system integrity, environmental adaptability, and support for emerging technologies such as distributed architectures and large-scale models—this study conducts an in-depth comparative analysis to reveal the differentiated patterns between domestic and international solutions. The findings indicate that international middleware demonstrates advantages in system integrity due to its mature ecosystems and standardized design, whereas domestic middleware, driven by the wave of localization, has achieved leapfrog progress based on cloud-native architectures. In particular, it exhibits unique competitiveness in service governance, compatibility with local software and hardware ecosystems, and application to emerging scenarios. Looking ahead, embedded middleware and soft bus technologies are evolving toward higher system integrity, stronger adaptability, and deeper integration with frontier technologies such as cloud-native computing and artificial intelligence. They are expected to become the foundational enablers of ubiquitous connectivity and intelligent collaboration for future applications, including intelligent manufacturing and smart cities.
文章引用：杨鹏飞, 郑天洋, 郭恒, 王泉. 嵌入式系统中间件和软总线综述[J]. 嵌入式技术与智能系统, 2025, 2(4): 240-254. https://doi.org/10.12677/etis.2025.24022

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